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BFM520,115

NXP Semiconductors

BFM520,115 by NXP Semiconductors

NXP Semiconductors' BFM520,115 is a NPN RF BJT transistor with 2 elements for switching applications. It operates in L Band with max fT of 9000 MHz. With a max IC of 0.07 A and hFE of 60, it's ideal for high-frequency signal amplification in compact electronic devices.

Median Price

$0.235

Lifecycle Status

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In-Stock Inventory

1k+

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Chip1Stop

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Bastille Electronics

Australia . 100 parts In-Stock

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Continental Prestige Electronics

USA . 5,660 parts In-Stock

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Argo Parts USA

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AZTECH Wire

Italy . 362 parts In-Stock

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Ampacity Inc.

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Overview

Unlock the power of cutting-edge technology with the BFM520,115 by NXP Semiconductors. As a leader in semiconductor manufacturing, NXP delivers top-quality RF Small Signal Bipolar Junction Transistors for a wide range of applications. From switching to L Band frequencies, this transistor offers superior performance and reliability. With its compact design and high operating temperature, the BFM520,115 is the perfect choice for your next project. Experience the value and benefits of NXP's expertise in semiconductor innovation with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, providing high efficiency and low noise performance.

Configuration: SEPARATE, 2 ELEMENTS

Having separate elements allows for greater flexibility in circuit design and can improve overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation in such scenarios.

Surface Mount: YES

Surface mount capability makes installation and assembly easier, making it ideal for compact and densely packed circuits.

Package Shape: RECTANGULAR

Rectangular shape provides efficient use of space on circuit boards and allows for easy placement and soldering.

Minimum DC Current Gain (hFE): 60

A higher minimum current gain ensures consistent and stable amplification of signals in various applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the transistor can withstand harsh environmental conditions and high temperature applications.

Maximum Collector-Emitter Voltage: 8 V

The maximum voltage rating allows the transistor to handle higher voltage levels without risk of damage or failure.

Maximum Collector Current (IC): 0.07 A

The maximum collector current rating ensures the transistor can handle high current loads without overheating or failing.

Nominal Transition Frequency (fT): 9000 MHz

With a high transition frequency, the transistor is capable of amplifying high-frequency signals accurately, making it suitable for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFM520,115 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE, HIGH RELIABILITY

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

8 V

Configuration:

Minimum DC Current Gain (hFE):

60

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

No. of Elements:

2

No. of Terminals:

6

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFM520,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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