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BFS17WH6327XTSA1

Infineon Technologies

BFS17WH6327XTSA1 by Infineon Technologies

BFS17WH6327XTSA1 by Infineon Technologies is an NPN RF small signal bipolar junction transistor (BJT) with a max collector-emitter voltage of 15V and a nominal transition frequency of 2500MHz. It is commonly used as an amplifier in applications requiring ultra high frequency band performance.

Median Price

$0.040

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1 parts In-Stock

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$0.019

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$0.019

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Rochester

USA . 1,000 parts In-Stock

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$0.047

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$0.044

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$0.040

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Verical

USA . 15,000 parts In-Stock

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Chip1Stop

Japan . 9,000 parts In-Stock

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Digiode

USA . 399 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Semi Source

USA . 9,000 parts In-Stock

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VNN

France . 6,307 parts In-Stock

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Vyrian

USA . 5,020 parts In-Stock

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Prism Electronics

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Semicontronic

India . 11,093 parts In-Stock

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$0.034

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$0.033

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$0.033

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11,093

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Ampacity Inc.

Singapore . 11,048 parts In-Stock

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$0.034

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Corphita

USA . 404 parts In-Stock

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$0.042

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$0.042

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Component Stockers USA

USA . 665,820 parts In-Stock

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$0.050

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$0.040

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$0.040

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665,820

$0.050

$0.040

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$0.040

Argo Parts USA

USA . 3,928 parts In-Stock

1+ parts

$0.080

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$0.077

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Continental Prestige Electronics

USA . 1,281 parts In-Stock

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$0.080

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$0.078

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$0.078

Netroflash

USA . 50 parts In-Stock

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$0.086

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$0.082

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$0.080

50

$0.086

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$0.082

$0.080

Modulus Dynamics

Lithuania . 11,747 parts In-Stock

1+ parts

$0.439

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$0.421

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$0.404

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Aztec Data Supply Inc.

USA . 1,513 parts In-Stock

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$0.500

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Corohmni

South Africa . 729 parts In-Stock

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$0.748

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Advanced Electronics

New Zealand . 400 parts In-Stock

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$1.641

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$1.559

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$1.559

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$1.641

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AZTECH Wire

Italy . 585 parts In-Stock

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Perfect Parts

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Eastek

USA . 33,000 parts In-Stock

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GreenTree Electronics

Israel . 11,060 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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iodParts Technologies Inc.

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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$0.565

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$0.565

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$0.565

$0.565

$0.565

Overview

Experience the power of cutting-edge technology with the BFS17WH6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon is known for delivering top-quality RF Small Signal Bipolar Junction Transistors. This NPN transistor offers exceptional performance and reliability, making it perfect for amplifier applications. With its surface mount capability and gull-wing terminals, installation is a breeze. Designed for ultra high frequency bands, this transistor ensures unparalleled signal transmission. Trust Infineon to provide you with the best in class technology that brings value, benefits, and advantages to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable devices.

Polarity or Channel Type: NPN

Common and widely used configuration in amplifier circuits.

Configuration: SINGLE

Simplified design for easier integration into circuits.

Transistor Application: AMPLIFIER

Specifically designed for amplification of signals.

Surface Mount: YES

Easy to mount on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Efficient use of space in circuit layout.

Terminal Form: GULL WING

Suitable for automated soldering processes.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Capable of handling high-frequency signals accurately.

No. of Terminals: 3

Simplifies connection in circuits.

Package Style (Meter): SMALL OUTLINE

Compact size for space-constrained applications.

Maximum Collector-Base Capacitance: 0.8 pF

Low capacitance for minimal signal distortion.

Maximum Collector-Emitter Voltage: 15 V

Suitable for low-voltage applications.

Transistor Element Material: SILICON

Common semiconductor material known for reliability.

Maximum Collector Current (IC): 0.025 A

Sufficient current handling capability for many applications.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for enhanced durability.

Terminal Position: DUAL

Enables versatility in circuit design.

Nominal Transition Frequency (fT): 2500 MHz

High transition frequency for faster signal processing.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFS17WH6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.8 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFS17WH6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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