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MPSH10RLRP

Onsemi

MPSH10RLRP by Onsemi

MPSH10RLRP by Onsemi is an NPN RF BJT with a max. collector-emitter voltage of 25V and fT of 650MHz. Ideal for amplifier applications, it has a max. power dissipation of 0.35W and operates in the ultra-high frequency band.

Median Price

$0.560

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 4,000 parts In-Stock

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$0.560

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$0.560

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DF Sales Co.

USA . 4,000 parts In-Stock

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$0.560

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Vyrian

USA . 1,713 parts In-Stock

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1,713

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Digiode

USA . 747 parts In-Stock

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747

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Distributors (Availability)

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Corohmni

South Africa . 303 parts In-Stock

1+ parts

$0.560

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303

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Component Stockers USA

USA . 401 parts In-Stock

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$99.990

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401

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Problanco Electronics

Mexico . 6,245 parts In-Stock

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Kulean Microsystems

USA . 5,935 parts In-Stock

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TANS Electronics

Latvia . 3,132 parts In-Stock

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Corphita

USA . 1,039 parts In-Stock

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SupplyDigital Components

Austria . 949 parts In-Stock

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949

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UHIMA Technologies

Türkiye . 160 parts In-Stock

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Overview

Unleash the power of innovation with the MPSH10RLRP by Onsemi, a high-quality RF Small Signal BJT that promises superior performance and reliability. Manufactured by one of the industry leaders, this NPN transistor is designed for amplifier applications in the ultra-high-frequency band. With its compact package and efficient design, this transistor offers unmatched value and benefits to customers looking for cutting-edge technology. Elevate your projects with the MPSH10RLRP and experience the difference in quality and performance that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material allows for lightweight and durable packaging, making the product easy to handle and resistant to damage.

Polarity or Channel Type: NPN

NPN polarity allows for easy integration with other NPN components, simplifying circuit design and implementation.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces space requirements, making it suitable for small signal applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and reliability in amplification circuits.

Package Shape: ROUND

Round package shape allows for easy mounting and placement in circular layouts or tight spaces.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, making it easy to solder and integrate into a circuit board.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ultra high frequency band capabilities allow for high-speed signal processing and communication, making it suitable for advanced applications.

No. of Terminals: 3

With 3 terminals, this BJT offers versatility in circuit design and connectivity options.

Maximum Power Dissipation (Abs): 0.35 W

With a high maximum power dissipation, this BJT can handle high power levels without overheating, ensuring reliability in operation.

Package Style (Meter): CYLINDRICAL

Cylindrical package style provides a compact and space-efficient design, suitable for applications where size matters.

Minimum DC Current Gain (hFE): 60

Minimum DC current gain of 60 ensures consistent and reliable amplification performance in various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this BJT can withstand elevated temperatures, making it suitable for demanding environments.

Maximum Collector-Base Capacitance: 0.7 pF

Low collector-base capacitance minimizes signal distortion and enhances high-frequency performance, ideal for amplifier applications.

Maximum Collector-Emitter Voltage: 25 V

With a high maximum collector-emitter voltage, this BJT can handle higher voltage applications with ease.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties and reliability, ensuring stable and consistent performance over time.

Maximum Collector Current (IC): 0.1 A

With a high maximum collector current, this BJT can handle larger currents, making it suitable for power amplifier circuits.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and durability, ensuring secure connections and long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and soldering on circuit boards, making installation hassle-free.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures reliable soldering and robust mechanical connections during manufacturing.

Nominal Transition Frequency (fT): 650 MHz

High nominal transition frequency enables fast signal switching and amplification, suitable for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH10RLRP attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.7 pF

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Minimum DC Current Gain (hFE):

60

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH10RLRP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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