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BFR193L3E6327XTMA1

Infineon Technologies

BFR193L3E6327XTMA1 by Infineon Technologies

BFR193L3E6327XTMA1 by Infineon Technologies is an NPN RF BJT transistor with a max operating temperature of 150°C. It has a min DC current gain of 70 and a max collector-emitter voltage of 12V, making it suitable for amplifier applications in the L Band frequency range up to 8000 MHz. This surface-mount chip carrier package features no-lead terminals and gold finish, meeting AEC-Q101 standards.

Median Price

$0.304

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,436 parts In-Stock

1+ parts

$0.304

100+ parts

$0.155

1k+ parts

$0.133

10k+ parts

$0.114

4,436

$0.304

$0.155

$0.133

$0.114

Newark

USA . 6,961 parts In-Stock

1+ parts

$0.319

100+ parts

$0.169

1k+ parts

$0.141

10k+ parts

-

6,961

$0.319

$0.169

$0.141

-

DigiKey

USA . 7,748 parts In-Stock

1+ parts

$0.370

100+ parts

$0.193

1k+ parts

$0.162

10k+ parts

$0.149

7,748

$0.370

$0.193

$0.162

$0.149

Rochester

USA . 5,966,900 parts In-Stock

1+ parts

-

100+ parts

$0.147

1k+ parts

$0.122

10k+ parts

$0.109

5,966,900

-

$0.147

$0.122

$0.109

Verical

USA . 5,940,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.136

5,940,000

-

-

-

$0.136

Distrelec

Netherlands . 15,000 parts In-Stock

1+ parts

-

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15,000

-

-

-

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Chip1Stop

Japan . 9,765 parts In-Stock

1+ parts

-

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9,765

-

-

-

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Farnell

UK . 5,679 parts In-Stock

1+ parts

-

100+ parts

$0.177

1k+ parts

$0.110

10k+ parts

$0.108

5,679

-

$0.177

$0.110

$0.108

Element14

Singapore . 5,679 parts In-Stock

1+ parts

-

100+ parts

$0.317

1k+ parts

$0.198

10k+ parts

$0.195

5,679

-

$0.317

$0.198

$0.195

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 261 parts In-Stock

1+ parts

$0.089

100+ parts

-

1k+ parts

-

10k+ parts

-

261

$0.089

-

-

-

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$0.164

-

-

-

TME

Poland . 756 parts In-Stock

1+ parts

$0.522

100+ parts

$0.228

1k+ parts

-

10k+ parts

-

756

$0.522

$0.228

-

-

NAC Semi

USA . 4,110,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,110,000

-

-

-

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Vyrian

USA . 620,264 parts In-Stock

1+ parts

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100+ parts

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620,264

-

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VNN

France . 4,148 parts In-Stock

1+ parts

-

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4,148

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 619,949 parts In-Stock

1+ parts

$0.080

100+ parts

-

1k+ parts

-

10k+ parts

-

619,949

$0.080

-

-

-

Corphita

USA . 557 parts In-Stock

1+ parts

$0.085

100+ parts

-

1k+ parts

-

10k+ parts

-

557

$0.085

-

-

-

Argo Parts USA

USA . 2,058 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

10k+ parts

$0.159

2,058

$0.164

-

-

$0.159

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.164

-

-

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Modulus Dynamics

Lithuania . 24,527 parts In-Stock

1+ parts

$1.916

100+ parts

$1.839

1k+ parts

$1.763

10k+ parts

-

24,527

$1.916

$1.839

$1.763

-

Eastek

USA . 6,015,000 parts In-Stock

1+ parts

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6,015,000

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RC Electronics

USA . 110,000 parts In-Stock

1+ parts

-

100+ parts

$0.190

1k+ parts

$0.180

10k+ parts

$0.170

110,000

-

$0.190

$0.180

$0.170

Perfect Parts

USA . 18,939 parts In-Stock

1+ parts

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18,939

-

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GreenTree Electronics

Israel . 15,000 parts In-Stock

1+ parts

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15,000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,505 parts In-Stock

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10,505

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Continental Prestige Electronics

USA . 6,115 parts In-Stock

1+ parts

-

100+ parts

$0.246

1k+ parts

$0.152

10k+ parts

$0.129

6,115

-

$0.246

$0.152

$0.129

iodParts Technologies Inc.

India . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the BFR193L3E6327XTMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in their RF Small Signal Bipolar Junction Transistors. Ideal for amplifier applications in the L band, this NPN transistor offers seamless integration with its surface mount design and chip carrier package style. With a maximum operating temperature of 150°C and gold terminal finish, customers can trust in the durability and efficiency of this product. Elevate your projects to new heights with the BFR193L3E6327XTMA1 and experience unparalleled performance like never before.

Feature Benefit Bullets

Polarity or Channel Type:

NPN - NPN transistors are commonly used in amplifier circuits, making this product suitable for amplification applications.

Configuration:

SINGLE - The single configuration simplifies circuit design and makes this transistor easy to integrate into new or existing systems.

Transistor Application:

AMPLIFIER - Designed specifically for amplifier applications, ensuring optimal performance in amplifying signals.

Surface Mount:

YES - Surface mount capability makes this transistor suitable for compact electronic devices and provides ease of assembly.

Package Shape:

RECTANGULAR - The rectangular package shape allows for efficient use of board space and facilitates a clean layout design.

Terminal Form:

NO LEAD - The no-lead terminal form simplifies assembly and reduces the risk of solder joint failure.

Highest Frequency Band:

L BAND - Suitable for applications in the L band frequency range, offering versatility in use within this specific range.

No. of Terminals:

3 - The three terminals provide flexibility in circuit connections while keeping the design simple and compact.

Maximum Power Dissipation (Abs):

0.58 W - With a high maximum power dissipation, this transistor can handle higher power levels without overheating.

Package Style (Meter):

CHIP CARRIER - The chip carrier package style provides protection for the transistor while allowing for efficient heat dissipation.

Minimum DC Current Gain (hFE):

70 - The high minimum DC current gain ensures consistent amplification performance across different operating conditions.

Maximum Operating Temperature:

150 °C - With a high maximum operating temperature, this transistor can withstand elevated temperatures in various environments.

Maximum Collector-Base Capacitance:

0.9 pF - Low collector-base capacitance minimizes signal distortion and improves high-frequency performance.

Maximum Collector-Emitter Voltage:

12 V - The high maximum collector-emitter voltage rating provides a wide voltage handling capability for different applications.

Transistor Element Material:

SILICON - Silicon transistors offer high reliability, low noise, and consistent performance compared to other materials.

Maximum Collector Current (IC):

0.08 A - The high maximum collector current allows for handling of higher current levels, making this transistor suitable for various applications.

Terminal Finish:

GOLD - Gold terminal finish ensures reliable electrical connections and prevents corrosion, ensuring long-term performance.

Terminal Position:

BOTTOM - The bottom terminal position simplifies PCB layout and provides easy access for soldering and connecting external components.

Case Connection:

COLLECTOR - The case connection at the collector terminal facilitates efficient heat dissipation, ensuring the transistor operates within optimal temperature limits.

Reference Standard:

AEC-Q101 - Compliance with the AEC-Q101 standard guarantees high reliability and quality for automotive electronics applications.

Nominal Transition Frequency (fT):

8000 MHz - The high nominal transition frequency indicates fast response times and excellent high-frequency performance for amplification applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR193L3E6327XTMA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.9 pF

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

70

Highest Frequency Band:

L BAND

JESD-30 Code:

R-XBCC-N3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

GOLD

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR193L3E6327XTMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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