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BFR520TT/R

NXP Semiconductors

BFR520TT/R by NXP Semiconductors

NXP Semiconductors' BFR520TT/R is a NPN RF BJT transistor with 9000 MHz fT. It's a single configuration amplifier for L Band applications, featuring 0.07 A IC and Gull Wing terminals. This small outline package has a plastic body, tin finish, and can withstand peak reflow at 260°C for up to 40s.

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Lifecycle Status

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5

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1k+

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VNN

France . 3,387 parts In-Stock

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Anansix

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Digiode

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Nova Conductors

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Vyrian

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AZTECH Wire

Italy . 294 parts In-Stock

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One Stop Electronics

USA . 1,345 parts In-Stock

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Ampacity Inc.

Singapore . 1,410 parts In-Stock

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Continental Prestige Electronics

USA . 5,267 parts In-Stock

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Corphita

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Argo Parts USA

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your amplifier designs with the BFR520TT/R by NXP Semiconductors. This RF Small Signal Bipolar Junction Transistor boasts top-quality construction and cutting-edge technology, making it a standout choice for amplification applications in the L Band frequency range. With its single configuration and NPN polarity, this transistor offers superior performance and reliability. Trust NXP Semiconductors to deliver unmatched value and exceptional benefits with the BFR520TT/R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material makes the transistor suitable for a wide range of applications while keeping the overall weight of the product low.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this transistor a good choice for amplifier applications.

Configuration: SINGLE

The single configuration simplifies the design and implementation of circuits, making it easier to integrate this transistor into various electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring reliable and efficient performance in amplification circuits.

Surface Mount: YES

Enables easy and efficient mounting on PCBs, saving space and allowing for automated assembly processes.

Highest Frequency Band: L BAND

Capable of operating in the L band frequency range, making it suitable for applications in communication systems and radar.

Maximum Collector Current (IC): 0.07 A

With a maximum collector current of 0.07 A, this transistor can handle moderate power levels, suitable for low to medium power applications.

Nominal Transition Frequency (fT): 9000 MHz

With a high transition frequency, this transistor can operate effectively at high frequencies, making it suitable for high-speed applications such as RF amplifiers.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR520TT/R attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

HIGH RELIABILITY, LOW NOISE

Maximum Collector Current (IC):

Configuration:

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR520TT/R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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