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BFR92PE6327

Infineon Technologies

BFR92PE6327 by Infineon Technologies

BFR92PE6327 by Infineon Technologies is a NPN RF BJT transistor with a max operating temperature of 150°C. It has a transition frequency of 5000 MHz and can handle a collector current of 0.03 A, making it ideal for L Band switching applications. This surface mount transistor comes in a small outline package with gull wing terminals.

Median Price

$0.404

Lifecycle Status

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22

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1k+

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Mouser Electronics

USA . 42,305 parts In-Stock

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$0.680

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$0.281

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$0.177

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$0.126

42,305

$0.680

$0.281

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$0.126

Verical

USA . 2,643 parts In-Stock

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$0.127

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TME

Poland . 3,104 parts In-Stock

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$0.290

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$0.149

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$0.130

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$0.117

3,104

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$0.117

Digiode

USA . 916 parts In-Stock

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American Microsemiconductor Inc.

USA . 1,280 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

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North Shore Components

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Spain . 15,193 parts In-Stock

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Rutronik

Germany . 9,000 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 4,308 parts In-Stock

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Component Electronics Inc.

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Cogito LLC

Ukraine . 2,980 parts In-Stock

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Speed Components Ltd

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Pegasus Components GmbH

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Tectiva GmbH

Germany . 1,700 parts In-Stock

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Prism Electronics

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

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Nova Conductors

Japan . 600 parts In-Stock

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Ampacity Inc.

Singapore . 99,047 parts In-Stock

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$0.116

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CoreStaff

Japan . 9,000 parts In-Stock

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$0.209

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$0.136

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$0.083

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$0.209

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Corphita

USA . 881 parts In-Stock

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$0.342

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$0.342

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Modulus Dynamics

Lithuania . 18,002 parts In-Stock

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$0.460

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$0.442

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$0.423

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Andel Nordic

Denmark . 844 parts In-Stock

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$18.900

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$13.231

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844

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Perfect Parts

USA . 411,448 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

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Eliminating Global Boundries, Inc

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Metaverse IC Inc.

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Kepictronics

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Argo Parts USA

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Overview

Experience high-quality performance with the BFR92PE6327 RF Small Signal Bipolar Junction Transistor from Infineon Technologies. This NPN transistor offers seamless switching capabilities in a compact, surface-mount package, making it ideal for L Band applications. With a minimum DC current gain of 70 and a nominal transition frequency of 5000 MHz, this transistor delivers reliable and efficient operation at temperatures up to 150°C. Trust in Infineon's expertise and innovative technology to elevate your RF designs and unlock new possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and ensures reliable performance in various operating conditions.

Polarity or Channel Type: NPN

NPN polarity allows for easy integration with other NPN components in circuits.

Configuration: SINGLE

Single configuration simplifies circuit design and layout.

Transistor Application: SWITCHING

Designed for switching applications, making it suitable for use in various electronic devices.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on PCBs.

Package Shape: RECTANGULAR

Rectangular package shape allows for compact placement on PCBs, saving space.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and ease of assembly.

Highest Frequency Band: L BAND

Suitable for applications in the L band frequency range, providing high-frequency performance.

No. of Terminals: 3

Three terminals enable easy connection and integration in circuit designs.

Maximum Power Dissipation (Abs): 0.28 W

Able to handle high power dissipation, ensuring reliable operation under demanding conditions.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs, ideal for compact electronic designs.

Minimum DC Current Gain (hFE): 70

A minimum DC current gain of 70 ensures consistent performance and amplification in circuits.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150°C, suitable for high-temperature environments.

Maximum Collector-Base Capacitance: 0.6 pF

Low collector-base capacitance enhances high-frequency performance and stability.

Maximum Collector-Emitter Voltage: 15 V

With a maximum collector-emitter voltage of 15V, it can withstand higher voltage applications.

Transistor Element Material: SILICON

Silicon material ensures high performance and reliability in various electronic applications.

Maximum Collector Current (IC): 0.03 A

Capable of handling a maximum collector current of 0.03A, suitable for low to medium current applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and layout.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperature of 260°C during assembly processes.

Nominal Transition Frequency (fT): 5000 MHz

High nominal transition frequency of 5000 MHz ensures excellent high-frequency performance.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR92PE6327 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.6 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

70

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR92PE6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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