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2N3010

Texas Instruments

2N3010 by Texas Instruments

2N3010 by Texas Instruments is a NPN BJT transistor with max. power dissipation of 0.3W, hFE of 25, and fT of 600MHz. Ideal for switching applications due to its max. collector-emitter voltage of 11V and max. collector current of 0.5A in a cylindrical package with wire terminals.

Median Price

$4.200

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 1,029 parts In-Stock

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$3.400

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Ace Electronics

USA . 3 parts In-Stock

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$5.000

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Vyrian

USA . 7,567 parts In-Stock

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Digiode

USA . 4,695 parts In-Stock

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PUI

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Electronic Expediters

USA . 100 parts In-Stock

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100

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Manoshevitz Elec. Sales

Israel . 36 parts In-Stock

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Holdelec - ElecDif-Pro

France . 28 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 20 parts In-Stock

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Resion

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LittleDiode

UK . 7 parts In-Stock

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PAR Electronics

UK . 5 parts In-Stock

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ECAB

Sweden . 5 parts In-Stock

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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M&R Communications

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Native Components

USA . 596 parts In-Stock

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$0.058

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$0.056

596

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$0.056

Parana Technologies

USA . 617 parts In-Stock

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$1.500

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$2.168

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DigiPath Technology Company

USA . 1,384 parts In-Stock

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$1.651

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$1.519

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ChromeModa Solutions

Germany . 2,862 parts In-Stock

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$1.685

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$1.382

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IDEA Electronic Components Group

UK . 387 parts In-Stock

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$1.685

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$1.516

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AZTECH Wire

Italy . 822 parts In-Stock

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$10.435

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$10.435

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One Stop Electronics

USA . 384 parts In-Stock

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$32.050

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Corphita

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Northwest PG Solutions

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Supply Digital

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Assy Fe

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RTC Component Inc.

USA . 2 parts In-Stock

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Overview

Unlock the power of superior performance and reliability with the Texas Instruments 2N3010 RF Small Signal Bipolar Junction Transistor. Crafted with precision and excellence by a renowned manufacturer, this NPN transistor offers unmatched quality for switching applications. Its robust design and high efficiency make it ideal for a wide range of electronic projects. Experience seamless functionality and unmatched value with the 2N3010 - the perfect choice for your next innovation.

Feature Benefit Bullets

Package Body Material: METAL

Metal packaging provides better heat dissipation, improving the overall performance and reliability of the transistor.

Polarity or Channel Type: NPN

NPN transistors are commonly used in switching applications, making this product suitable for a wide range of electronic circuits.

Configuration: SINGLE

Single configuration simplifies circuit design and makes the transistor easier to integrate into electronic systems.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast response times and efficient control of current flow.

Package Shape: ROUND

Round package shape allows for easy mounting and soldering, reducing the chances of misalignment during assembly.

Terminal Form: WIRE

Wire terminals make it easy to connect the transistor to a circuit board or other components without the need for additional tools.

No. of Terminals: 3

3 terminals provide flexibility in circuit connections and allow for a variety of different configurations.

Maximum Power Dissipation (Abs): 0.3 W

With a high maximum power dissipation, this transistor can handle increased power levels without overheating or failing.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers a compact and space-saving design, ideal for applications where size is a concern.

Minimum DC Current Gain (hFE): 25

Minimum DC current gain of 25 ensures stable and reliable amplification of current in a circuit.

Maximum Operating Temperature: 175 °C

High maximum operating temperature of 175°C allows the transistor to operate efficiently in a wide range of environmental conditions.

Maximum Collector-Emitter Voltage: 11 V

With a maximum collector-emitter voltage of 11V, this transistor is suitable for low to medium voltage applications.

Transistor Element Material: SILICON

Silicon transistor element material offers high performance and reliability, making it a popular choice for electronic devices.

Maximum Collector Current (IC): 0.5 A

Maximum collector current of 0.5A allows the transistor to handle higher current loads for various applications.

Terminal Position: BOTTOM

Bottom terminal position makes it easy to mount the transistor securely on a circuit board and maintain stable connections.

Nominal Transition Frequency (fT): 600 MHz

High nominal transition frequency of 600MHz indicates the transistor's capability to switch signals at high speeds, making it suitable for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) 2N3010 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Texas Instruments

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

11 V

Configuration:

Minimum DC Current Gain (hFE):

25

JEDEC-95 Code:

TO-18

JESD-30 Code:

O-MBCY-W3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

2N3010 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-00-502-4490, 5961005024490, 5961-00-919-1022, 5961009191022

NIIN

005024490, 009191022

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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