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BFP740E6327HTSA1

Infineon Technologies

BFP740E6327HTSA1 by Infineon Technologies

BFP740E6327HTSA1 by Infineon is a NPN RF BJT with 19.5 dB power gain, ideal for C band applications. It has a max operating temp of 150°C, fT of 44 GHz, and can handle up to 0.045 A collector current. This small outline transistor is designed for amplifier circuits requiring high frequency performance.

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4

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1k+

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Vyrian

USA . 8,547 parts In-Stock

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VNN

France . 3,679 parts In-Stock

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Digiode

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Nova Conductors

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Modulus Dynamics

Lithuania . 6,987 parts In-Stock

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$0.725

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$0.696

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$0.667

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AZTECH Wire

Italy . 253 parts In-Stock

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Ampacity Inc.

Singapore . 1,221 parts In-Stock

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$50.050

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Component Stockers USA

USA . 286 parts In-Stock

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$99.990

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Argo Parts USA

USA . 3,570 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,126 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unlock the power of seamless connectivity with Infineon Technologies' BFP740E6327HTSA1 RF Small Signal Bipolar Junction Transistor. Crafted with precision and expertise, this NPN transistor offers unparalleled performance in amplifier applications within the C band frequency range. With a high minimum power gain of 19.5 dB and a compact gull wing package design, this transistor delivers superior quality and reliability. Experience enhanced signal amplification and efficiency with the BFP740E6327HTSA1, setting new standards for connectivity solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various environments.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits and are versatile in electronic applications.

Minimum Power Gain (Gp) 19.5 dB

High minimum power gain ensures efficient amplification of signals.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and mounting on circuit boards.

Highest Frequency Band: C BAND

Suitable for high-frequency applications in the C band range.

Maximum Power Dissipation (Abs) 0.16 W

Can handle a maximum power dissipation of 0.16 W, making it suitable for various power levels.

Minimum DC Current Gain (hFE) 160

High minimum DC current gain ensures stable and reliable amplification.

Maximum Collector-Emitter Voltage 4 V

Operates efficiently within a maximum collector-emitter voltage of 4 V.

Maximum Collector Current (IC) 0.045 A

Supports a maximum collector current of 0.045 A, suitable for low-power applications.

Nominal Transition Frequency (fT) 44000 MHz

High nominal transition frequency allows for high-speed switching and amplification capabilities.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP740E6327HTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.08 pF

Maximum Collector-Emitter Voltage:

4 V

Configuration:

Minimum DC Current Gain (hFE):

160

Highest Frequency Band:

C BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

19.5 dB

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON GERMANIUM CARBON

Nominal Transition Frequency (fT):

Trade Compliance

BFP740E6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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