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BFP780H6327XTSA1

Infineon Technologies

BFP780H6327XTSA1 by Infineon Technologies

BFP780H6327XTSA1 by Infineon is a NPN RF BJT with 4 terminals, operating at -40°C to 6.1V. It's a single-configured transistor for ultra-high frequency amplification applications in small outline package style with Gull Wing terminals. With a max collector current of 0.12A and fT of 20GHz, it's ideal for high-frequency amplifier circuits requiring compact design.

Median Price

$1.040

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16 parts In-Stock

1+ parts

-

100+ parts

$1.040

1k+ parts

$0.863

10k+ parts

$0.770

16

-

$1.040

$0.863

$0.770

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 156 parts In-Stock

1+ parts

$0.813

100+ parts

-

1k+ parts

-

10k+ parts

-

156

$0.813

-

-

-

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$1.097

100+ parts

-

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-

10k+ parts

-

69

$1.097

-

-

-

Vyrian

USA . 7,884 parts In-Stock

1+ parts

-

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7,884

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Chip Stock

USA . 885 parts In-Stock

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885

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VNN

France . 75 parts In-Stock

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75

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 34,518 parts In-Stock

1+ parts

$0.440

100+ parts

-

1k+ parts

-

10k+ parts

-

34,518

$0.440

-

-

-

Corohmni

South Africa . 415 parts In-Stock

1+ parts

$0.669

100+ parts

-

1k+ parts

-

10k+ parts

-

415

$0.669

-

-

-

Ampacity Inc.

Singapore . 16 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

-

10k+ parts

-

16

$0.730

-

-

-

Semicontronic

India . 16 parts In-Stock

1+ parts

$0.730

100+ parts

$0.712

1k+ parts

$0.708

10k+ parts

-

16

$0.730

$0.712

$0.708

-

Corphita

USA . 829 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

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829

$0.770

-

-

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Continental Prestige Electronics

USA . 5,567 parts In-Stock

1+ parts

$1.097

100+ parts

-

1k+ parts

-

10k+ parts

$1.076

5,567

$1.097

-

-

$1.076

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.097

100+ parts

-

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2,000

$1.097

-

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Argo Parts USA

USA . 1,109 parts In-Stock

1+ parts

$1.097

100+ parts

-

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1,109

$1.097

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Modulus Dynamics

Lithuania . 4,729 parts In-Stock

1+ parts

$1.964

100+ parts

$1.885

1k+ parts

$1.807

10k+ parts

-

4,729

$1.964

$1.885

$1.807

-

AZTECH Wire

Italy . 439 parts In-Stock

1+ parts

$16.155

100+ parts

-

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439

$16.155

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Lixinc

USA . 14,040 parts In-Stock

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14,040

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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3,000

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-

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Robosynatics

Brazil . 900 parts In-Stock

1+ parts

-

100+ parts

$1.760

1k+ parts

$1.630

10k+ parts

$1.630

900

-

$1.760

$1.630

$1.630

Lucentia Tech

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$1.760

1k+ parts

$1.630

10k+ parts

$1.630

900

-

$1.760

$1.630

$1.630

GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

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500

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Microchip USA

USA . 489 parts In-Stock

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489

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Unleash the power of cutting-edge technology with the BFP780H6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon brings you top-quality RF Small Signal Bipolar Junction Transistors (BJT) that guarantee superior performance and reliability. Whether you're amplifying signals or working in the ultra-high-frequency band, this transistor is the perfect solution for your needs. Experience seamless connectivity and precision engineering with the BFP780H6327XTSA1, delivering unparalleled value and benefits to customers seeking high-performance electronic components. Elevate your projects to new heights with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification in electronic circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Single configuration transistors are easier to integrate into circuits compared to multiple configurations, simplifying design and reducing complexity.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplifying electronic signals.

Surface Mount: YES

Surface mount transistors are easier to solder onto circuit boards, saving time and effort during assembly.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and easy soldering, improving reliability and ease of use.

No. of Terminals: 4

Having 4 terminals allows for more versatile connection options, increasing flexibility in circuit design.

Maximum Collector-Emitter Voltage: 6.1 V

With a high maximum voltage rating, this transistor can withstand higher voltages without failing, ensuring robust performance.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and efficiency, making this transistor a dependable choice.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this transistor can function effectively in a wide range of environments, including extreme cold conditions.

Maximum Collector Current (IC): 0.12 A

The high maximum collector current allows this transistor to handle larger currents, making it suitable for various amplifier applications.

Terminal Finish: TIN

Tin terminals provide good conductivity and solderability, ensuring secure connections and reliable performance in electronic circuits.

Terminal Position: DUAL

Having dual terminal positions allows for multiple connection options, giving designers more flexibility in circuit layouts.

Case Connection: EMITTER

The case connection at the emitter terminal simplifies circuit design and layout, improving efficiency and reducing complexity.

Nominal Transition Frequency (fT): 20000 MHz

With a high transition frequency, this transistor can operate at high frequencies, making it ideal for ultra-high frequency band applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP780H6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Case Connection:

EMITTER

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

6.1 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFP780H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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