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MPSA10RLRA

Onsemi

MPSA10RLRA by Onsemi

MPSA10RLRA by Onsemi is an NPN RF BJT with a max collector-emitter voltage of 25V and fT of 650MHz. It is used in ultra-high frequency applications due to its low capacitance (0.7pF) and high operating temp (150 °C). The transistor's through-hole package makes it suitable for various cylindrical-shaped devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,029 parts In-Stock

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Problanco Electronics

Mexico . 6,387 parts In-Stock

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Kulean Microsystems

USA . 5,967 parts In-Stock

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TANS Electronics

Latvia . 3,687 parts In-Stock

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SupplyDigital Components

Austria . 1,473 parts In-Stock

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Corphita

USA . 1,311 parts In-Stock

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UHIMA Technologies

Türkiye . 863 parts In-Stock

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Corohmni

South Africa . 376 parts In-Stock

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Overview

Looking for a reliable RF Small Signal Bipolar Junction Transistor (BJT)? Look no further than the MPSA10RLRA by Onsemi. With a reputation for quality and innovation, Onsemi delivers top-notch products that excel in various applications. This NPN transistor offers customers exceptional value with its high performance in the ultra-high-frequency band. Whether you're working on communication systems or electronic devices, the MPSA10RLRA provides the reliability and efficiency you need to succeed. Choose Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various operating conditions.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification and switching applications, making this product versatile in different circuit designs.

Configuration: SINGLE

The single configuration simplifies circuit design and saves space, making it easier to integrate into electronic devices.

Package Shape: ROUND

The round package shape allows for efficient heat dissipation and easy mounting in circular layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections and are ideal for manual soldering, ensuring reliable performance.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

The ultra-high frequency band capability allows for high-speed signal processing, making this transistor ideal for cutting-edge electronic applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliable performance in demanding environments, increasing the lifespan of the transistor.

Maximum Collector-Base Capacitance: 0.7 pF

The low collector-base capacitance minimizes signal distortion and improves high-frequency response, making this transistor suitable for high-speed applications.

Maximum Collector-Emitter Voltage: 25 V

The high collector-emitter voltage rating allows for handling higher voltages, making this transistor suitable for a wide range of circuit designs.

Transistor Element Material: SILICON

Silicon transistors offer excellent performance characteristics and reliability, ensuring consistent operation over the product's lifespan.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and resistance to corrosion, ensuring robust connections in various environments.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and secure mounting on circuit boards, ensuring reliable electrical connections.

Nominal Transition Frequency (fT): 650 MHz

The high nominal transition frequency indicates fast switching speeds and excellent high-frequency performance, making this transistor suitable for high-speed applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSA10RLRA attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.7 pF

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSA10RLRA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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