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MMBT918LT1

Onsemi

MMBT918LT1 by Onsemi

MMBT918LT1 by Onsemi is an NPN RF BJT transistor with a max fT of 600 MHz. It has a max IC of 0.05 A and operates up to 150 °C, making it suitable for ultra-high frequency amplifier applications in small outline packages.

Median Price

$0.719

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Master Electronics

USA . 23,430 parts In-Stock

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$0.430

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$0.310

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$0.310

Verical

USA . 23,400 parts In-Stock

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$1.008

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$1.008

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Vyrian

USA . 1,819 parts In-Stock

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$0.172

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$0.172

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TEDSS.com

USA . 12,000 parts In-Stock

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$0.210

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$0.085

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$0.210

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Chip Stock

USA . 184,367 parts In-Stock

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Electronic Expediters

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EMSNET

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ACDS - Activité Composants Distribution Service

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Mil-Aero Solutions, Inc.

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Semi Source

USA . 5,500 parts In-Stock

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Bristol Electronics

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PC Components Company LLC

USA . 4,154 parts In-Stock

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Inventory MP

USA . 4,060 parts In-Stock

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R&J Components

USA . 3,000 parts In-Stock

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Sogenti Electronics

Canada . 3,000 parts In-Stock

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Resion

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Prism Electronics

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Sensible Micro Corp

USA . 2,655 parts In-Stock

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$0.039

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$0.036

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Microfarads

USA . 2,438 parts In-Stock

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Speed Components Ltd

Israel . 2,389 parts In-Stock

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LWI Electronics Inc

India . 2,190 parts In-Stock

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Atlantic Semiconductor

USA . 1,000 parts In-Stock

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Digiode

USA . 357 parts In-Stock

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Corohmni

South Africa . 420 parts In-Stock

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$0.039

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Component Stockers USA

USA . 34,402 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,394 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 7,809 parts In-Stock

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Kulean Microsystems

USA . 7,684 parts In-Stock

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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Problanco Electronics

Mexico . 3,824 parts In-Stock

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SupplyDigital Components

Austria . 3,714 parts In-Stock

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Kepictronics

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Assy Fe

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Corphita

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UHIMA Technologies

Türkiye . 913 parts In-Stock

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Overview

Unleash the power of innovation with the MMBT918LT1 by Onsemi, a top-tier manufacturer known for delivering high-quality RF Small Signal Bipolar Junction Transistors. This NPN transistor is designed for ultra-high-frequency applications, making it ideal for amplifiers. With its small outline package and impressive transition frequency of 600 MHz, this transistor offers unparalleled performance and reliability. Elevate your projects to new heights with the MMBT918LT1 and experience the difference that premium quality components can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and durability, making the transistor suitable for various environments.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits due to their high input impedance and low noise.

Configuration: SINGLE

Single configuration simplifies circuit design and allows for easy integration into amplifier circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring high performance in signal amplification.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures the transistor can perform reliably in a wide range of operating conditions.

Maximum Power Dissipation (Abs): 0.225 W

Good power dissipation capabilities enable the transistor to handle high power levels without overheating.

Minimum DC Current Gain (hFE): 20

High DC current gain ensures efficient signal amplification and improves overall performance of the transistor.

Nominal Transition Frequency (fT): 600 MHz

High transition frequency allows for high-speed signal processing, making the transistor suitable for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBT918LT1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

3 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

20

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBT918LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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