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BFP740H6327XTSA1

Infineon Technologies

BFP740H6327XTSA1 by Infineon Technologies

BFP740H6327XTSA1 by Infineon Technologies is an NPN RF BJT with a Gp of 19.5 dB, ideal for amplifier applications in the C band. It features a hFE of 160, fT of 44 GHz, and can operate b/w -55 to 150°C. The transistor has a max Vce of 4.2V and IC of 0.045A, making it suitable for high-frequency amplification needs.

Median Price

$0.244

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 518 parts In-Stock

1+ parts

$0.151

100+ parts

-

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518

$0.151

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DigiKey

USA . 3,777 parts In-Stock

1+ parts

$0.610

100+ parts

$0.333

1k+ parts

$0.282

10k+ parts

-

3,777

$0.610

$0.333

$0.282

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Mouser Electronics

USA . 943 parts In-Stock

1+ parts

$0.840

100+ parts

$0.331

1k+ parts

$0.276

10k+ parts

$0.225

943

$0.840

$0.331

$0.276

$0.225

Chip1Stop

Japan . 8,985 parts In-Stock

1+ parts

-

100+ parts

$0.138

1k+ parts

$0.130

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8,985

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$0.138

$0.130

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Rochester

USA . 3,089 parts In-Stock

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-

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$0.264

1k+ parts

$0.219

10k+ parts

$0.195

3,089

-

$0.264

$0.219

$0.195

RS (Exports)

UK . 2,950 parts In-Stock

1+ parts

-

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$0.159

2,950

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$0.159

Verical

USA . 1,659 parts In-Stock

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$0.244

1,659

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$0.244

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 902 parts In-Stock

1+ parts

$0.170

100+ parts

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902

$0.170

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-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.206

100+ parts

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10

$0.206

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Vyrian

USA . 4,902 parts In-Stock

1+ parts

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4,902

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IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

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$0.278

3,000

-

-

-

$0.278

TME

Poland . 2,397 parts In-Stock

1+ parts

-

100+ parts

$0.231

1k+ parts

$0.226

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2,397

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$0.231

$0.226

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VNN

France . 800 parts In-Stock

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800

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Ampacity Inc.

Singapore . 5,089 parts In-Stock

1+ parts

$0.135

100+ parts

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5,089

$0.135

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Corphita

USA . 993 parts In-Stock

1+ parts

$0.161

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993

$0.161

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Argo Parts USA

USA . 1,461 parts In-Stock

1+ parts

$0.203

100+ parts

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10k+ parts

$0.197

1,461

$0.203

-

-

$0.197

Semicontronic

India . 4,929 parts In-Stock

1+ parts

$0.235

100+ parts

$0.229

1k+ parts

$0.228

10k+ parts

-

4,929

$0.235

$0.229

$0.228

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.604

100+ parts

$0.550

1k+ parts

$0.495

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200

$0.604

$0.550

$0.495

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Aztec Data Supply Inc.

USA . 3,747 parts In-Stock

1+ parts

$0.742

100+ parts

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3,747

$0.742

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Modulus Dynamics

Lithuania . 15,768 parts In-Stock

1+ parts

$1.593

100+ parts

$1.529

1k+ parts

$1.466

10k+ parts

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15,768

$1.593

$1.529

$1.466

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Corohmni

South Africa . 281 parts In-Stock

1+ parts

$1.771

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281

$1.771

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Epart123

USA . 30,000 parts In-Stock

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$0.480

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Perfect Parts

USA . 24,929 parts In-Stock

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GreenTree Electronics

Israel . 21,000 parts In-Stock

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S.R.D Solutions

India . 15,000 parts In-Stock

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,815 parts In-Stock

1+ parts

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$0.186

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$0.132

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2,815

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$0.186

$0.132

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$0.202

1k+ parts

$0.196

10k+ parts

$0.192

50

-

$0.202

$0.196

$0.192

Overview

Experience unmatched performance and reliability with the BFP740H6327XTSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch RF Small Signal Bipolar Junction Transistors like no other. This NPN transistor is perfect for amplifier applications in the C Band, offering a power gain of 19.5 dB and a transition frequency of 44,000 MHz. With a compact design and high-quality materials, this transistor ensures optimal functionality and efficiency. Trust Infineon to provide you with the best-in-class products for all your RF signal needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifier circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Simplified circuit design with a single transistor configuration.

Minimum Power Gain (Gp): 19.5 dB

Provides good amplification capabilities for the transistor.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, increasing the reliability of the transistor.

Nominal Transition Frequency (fT): 44000 MHz

High transition frequency allows for high-speed applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP740H6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.14 pF

Maximum Collector-Emitter Voltage:

4.2 V

Configuration:

Minimum DC Current Gain (hFE):

160

Highest Frequency Band:

C BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Minimum Power Gain (Gp):

19.5 dB

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON GERMANIUM CARBON

Nominal Transition Frequency (fT):

Trade Compliance

BFP740H6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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