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BFP540FESDH6327XTSA1

Infineon Technologies

BFP540FESDH6327XTSA1 by Infineon Technologies

BFP540FESDH6327XTSA1 by Infineon is a NPN RF BJT transistor with 4.5V VCEO, 0.08A IC, and 30GHz fT. It is used in S Band amplifiers for high-frequency applications. The package is small outline, surface mountable with flat terminals, suitable for AEC-Q101 standards.

Median Price

$0.249

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,252 parts In-Stock

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$0.164

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1,252

$0.164

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Adafruit Industries

USA . 600 parts In-Stock

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$0.245

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$0.245

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$0.245

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600

$0.245

$0.245

$0.245

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DigiKey

USA . 2 parts In-Stock

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$0.580

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2

$0.580

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Mouser Electronics

USA . 20 parts In-Stock

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$0.680

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$0.359

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$0.303

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20

$0.680

$0.359

$0.303

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Verical

USA . 141,000 parts In-Stock

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$0.212

141,000

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$0.212

Rochester

USA . 35,483 parts In-Stock

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$0.249

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$0.207

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$0.184

35,483

-

$0.249

$0.207

$0.184

EBV Elektronik

Germany . 6,000 parts In-Stock

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6,000

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RS (Exports)

UK . 2,875 parts In-Stock

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$0.267

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$0.246

2,875

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$0.267

$0.246

Chip1Stop

Japan . 1,570 parts In-Stock

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$0.147

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1,570

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$0.147

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Element14

Singapore . 80 parts In-Stock

1+ parts

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$0.445

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$0.343

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$0.292

80

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$0.445

$0.343

$0.292

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 255 parts In-Stock

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$0.194

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255

$0.194

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Nova Conductors

Japan . 21 parts In-Stock

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$0.247

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21

$0.247

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VNN

France . 22,170 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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$0.281

6,000

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$0.281

Vyrian

USA . 3,298 parts In-Stock

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Bristol Electronics

USA . 903 parts In-Stock

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Ampacity Inc.

Singapore . 26,501 parts In-Stock

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$0.145

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$0.145

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Semicontronic

India . 7,249 parts In-Stock

1+ parts

$0.154

100+ parts

$0.150

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$0.149

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7,249

$0.154

$0.150

$0.149

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Corphita

USA . 960 parts In-Stock

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$0.184

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960

$0.184

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$0.245

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$0.245

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$0.245

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600

$0.245

$0.245

$0.245

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Argo Parts USA

USA . 1,552 parts In-Stock

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$0.247

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$0.239

1,552

$0.247

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$0.239

Continental Prestige Electronics

USA . 2,958 parts In-Stock

1+ parts

$0.370

100+ parts

$0.238

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$0.167

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2,958

$0.370

$0.238

$0.167

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Aztec Data Supply Inc.

USA . 786 parts In-Stock

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$0.441

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786

$0.441

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Corohmni

South Africa . 767 parts In-Stock

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$0.778

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767

$0.778

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Modulus Dynamics

Lithuania . 24,188 parts In-Stock

1+ parts

$1.399

100+ parts

$1.343

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$1.287

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24,188

$1.399

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Perfect Parts

USA . 75,653 parts In-Stock

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Epart123

USA . 30,000 parts In-Stock

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Eastek

USA . 18,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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GreenTree Electronics

Israel . 2,996 parts In-Stock

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2,996

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Overview

Looking for a high-quality RF Small Signal BJT with exceptional performance? Look no further than the BFP540FESDH6327XTSA1 by Infineon Technologies. Manufactured by a trusted industry leader, this NPN transistor is perfect for amplifier applications in the S Band frequency range. Its small outline package and flat terminals make it easy to mount, while its superior silicon element material ensures reliable operation. Get the best in performance and quality with this transistor from Infineon Technologies!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Polarity or Channel Type: NPN

Commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Simplifies circuit design and troubleshooting, ideal for straightforward amplifier setups.

Transistor Application: AMPLIFIER

Designed specifically for amplification tasks, ensuring optimal performance in amplifier circuits.

Surface Mount: YES

Easy to integrate into surface-mount technology (SMT) PCB designs, enhancing manufacturing efficiency.

Highest Frequency Band: S BAND

Capable of operating in the S band frequency range, suitable for high-frequency amplification applications.

Maximum Collector-Base Capacitance: 0.26 pF

Low capacitance helps in high-frequency applications by reducing signal distortion and improving overall performance.

Maximum Collector-Emitter Voltage: 4.5 V

With a relatively high collector-emitter voltage rating, this transistor offers flexibility and reliability in various circuit environments.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its stability and efficiency, ensuring consistent performance.

Maximum Collector Current (IC): 0.08 A

Able to handle relatively high collector currents, making it suitable for moderate power amplification applications.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring secure connections in the circuit.

Nominal Transition Frequency (fT): 30000 MHz

High transition frequency indicates fast response and excellent high-frequency performance, essential for amplifier applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFP540FESDH6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.26 pF

Maximum Collector-Emitter Voltage:

4.5 V

Configuration:

Highest Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-F4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFP540FESDH6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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