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BFU520VL

NXP Semiconductors

BFU520VL by NXP Semiconductors

NXP Semiconductors' BFU520VL is a NPN BJT transistor with 4 terminals, ideal for L Band applications. With a max fT of 10500 MHz and hFE of 60, it operates at temperatures from -40 to 150 °C, making it suitable for high-frequency amplifier circuits in various electronic devices.

Median Price

$0.137

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

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$0.137

1k+ parts

$0.113

10k+ parts

$0.101

10,000

-

$0.137

$0.113

$0.101

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 20,000 parts In-Stock

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VNN

France . 4,321 parts In-Stock

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4,321

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Vyrian

USA . 2,542 parts In-Stock

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Anansix

USA . 1,594 parts In-Stock

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1,594

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Digiode

USA . 319 parts In-Stock

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319

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,368 parts In-Stock

1+ parts

$0.310

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2,368

$0.310

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Microchip USA

USA . 12,498 parts In-Stock

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$0.785

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$0.785

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Corohmni

South Africa . 75 parts In-Stock

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$0.910

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75

$0.910

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Semicontronic

India . 1,536 parts In-Stock

1+ parts

$4.050

100+ parts

$3.949

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$3.928

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-

1,536

$4.050

$3.949

$3.928

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AZTECH Wire

Italy . 703 parts In-Stock

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$12.500

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703

$12.500

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One Stop Electronics

USA . 1,085 parts In-Stock

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$24.050

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1,085

$24.050

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Ampacity Inc.

Singapore . 268 parts In-Stock

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$57.050

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$57.050

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UNI Independent Distributors

Spain . 7,084 parts In-Stock

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Continental Prestige Electronics

USA . 5,015 parts In-Stock

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Corphita

USA . 2,093 parts In-Stock

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Argo Parts USA

USA . 1,792 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the NXP Semiconductors BFU520VL RF Small Signal Bipolar Junction Transistor. This high-quality NPN transistor, designed for amplifier applications in the L Band frequency range, offers unparalleled performance and reliability. With a maximum operating temperature of 150°C and a nominal transition frequency of 10500 MHz, this transistor is perfect for a wide range of applications. Trust NXP Semiconductors to deliver superior quality and innovation, ensuring you stay ahead of the competition. Elevate your projects with the BFU520VL and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material helps in reducing weight and cost of the overall product without compromising on durability.

Polarity or Channel Type: NPN

NPN type transistors are commonly used in amplifier circuits, making this product suitable for amplifier applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and reduces complexity.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplifying signal.

Surface Mount: YES

Surface mount package allows for easy and space-saving PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient placement and orientation on the PCB.

Terminal Form: GULL WING

Gull wing terminals provide good solder joint reliability during PCB assembly.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 16 V

With a high collector-emitter voltage, this transistor can handle higher voltage levels in the circuit.

Nominal Transition Frequency (fT): 10500 MHz

High transition frequency enables the transistor to operate at higher frequencies, making it suitable for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFU520VL attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.52 pF

Maximum Collector-Emitter Voltage:

16 V

Configuration:

Minimum DC Current Gain (hFE):

60

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101; IEC-60134

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFU520VL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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