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BFU520XR,235

NXP Semiconductors

BFU520XR,235 by NXP Semiconductors

NXP Semiconductors' BFU520XR,235 is a NPN RF BJT transistor with 4 terminals. It operates in L Band with a max fT of 10500 MHz and hFE of 60. Ideal for amplifier applications, it has a max power dissipation of 0.45 W and can handle up to 16 V collector-emitter voltage.

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5

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1k+

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Vyrian

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Anansix

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 437 parts In-Stock

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Ampacity Inc.

Singapore . 347 parts In-Stock

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One Stop Electronics

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Overview

Unlock a world of endless possibilities with the BFU520XR,235 by NXP Semiconductors. This RF Small Signal Bipolar Junction Transistor is designed for high performance amplification in the L Band frequency range, making it ideal for a wide range of applications. With NXP's reputation for top-quality manufacturing and innovative technology, you can trust that this product will deliver unmatched reliability and precision. Experience the difference with the BFU520XR,235 and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring reliability and durability.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Simplifies circuit design and integration, making it easy to use in various electronic devices.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal boosting.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and facilitating mass production.

Package Shape: RECTANGULAR

Compact and efficient shape for easy integration into circuit layouts.

Terminal Form: GULL WING

Facilitates efficient soldering and secure connection to the circuit board.

Maximum Operating Temperature: 150 °C

Can operate reliably at high temperatures, suitable for harsh environments.

Nominal Transition Frequency (fT): 10500 MHz

High transition frequency allows for high-speed signal amplification and processing.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFU520XR,235 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.28 pF

Maximum Collector-Emitter Voltage:

16 V

Configuration:

Minimum DC Current Gain (hFE):

60

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101; IEC-60134

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFU520XR,235 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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