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BFU520XR

NXP Semiconductors

BFU520XR by NXP Semiconductors

The NXP Semiconductors BFU520XR is an NPN RF BJT transistor with a max fT of 10500 MHz. It has a collector-emitter voltage of 16V and operates in the L band frequency range. Ideal for amplifier applications, it comes in a small outline package with gull wing terminals for surface mount assembly.

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Flip Electronics

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Nova Conductors

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AZTECH Wire

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Ampacity Inc.

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One Stop Electronics

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Overview

Looking to amplify your RF signals with precision and reliability? Look no further than the NXP Semiconductors BFU520XR. As a leading manufacturer in the industry, NXP delivers top-notch quality and innovation in every product. The BFU520XR falls under the category of RF Small Signal Bipolar Junction Transistors, making it perfect for amplifier applications in the L Band frequency range. With a maximum power dissipation of 0.45 W and a nominal transition frequency of 10500 MHz, this transistor offers unparalleled performance and value to customers seeking high-quality solutions for their electronic projects. Trust NXP Semiconductors to deliver excellence with the BFU520XR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring reliability in various operating conditions.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Simplifies circuit design and integration, making it easier to use in amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplification circuits.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly processes.

Maximum Power Dissipation (Abs): 0.45 W

Can handle relatively high power levels, making it suitable for amplification applications.

Minimum DC Current Gain (hFE): 60

Ensures consistent and stable amplification performance in various operating conditions.

Maximum Collector-Emitter Voltage: 16 V

Provides a high voltage rating, making it suitable for use in circuits that require higher voltage levels.

Nominal Transition Frequency (fT): 10500 MHz

High transition frequency allows for amplification of high-frequency signals, making it suitable for applications in the L Band.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFU520XR attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.28 pF

Maximum Collector-Emitter Voltage:

16 V

Configuration:

Minimum DC Current Gain (hFE):

60

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101; IEC-60134

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFU520XR Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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