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MPSH11RL1

Onsemi

MPSH11RL1 by Onsemi

MPSH11RL1 by Onsemi is an NPN RF BJT with 3 terminals, operating at a max temp of 150 °C. It has a fT of 650 MHz and Vce(max) of 25V, suitable for ultra-high frequency applications due to its low collector-base capacitance of 0.7 pF.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 1,903 parts In-Stock

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Digiode

USA . 981 parts In-Stock

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981

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Kulean Microsystems

USA . 7,818 parts In-Stock

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TANS Electronics

Latvia . 6,572 parts In-Stock

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SupplyDigital Components

Austria . 2,389 parts In-Stock

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Corphita

USA . 2,315 parts In-Stock

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UHIMA Technologies

Türkiye . 507 parts In-Stock

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Corohmni

South Africa . 289 parts In-Stock

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Problanco Electronics

Mexico . 278 parts In-Stock

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Overview

Discover the unparalleled performance and reliability of the MPSH11RL1 by Onsemi, a leading manufacturer in the industry. This RF Small Signal Bipolar Junction Transistor (BJT) is designed to deliver exceptional results in ultra-high frequency applications. With a single configuration and NPN polarity, this transistor offers seamless integration and superior functionality. Whether you're working on telecommunications, radar systems, or medical equipment, the MPSH11RL1 provides unmatched value and efficiency. Elevate your projects with this high-quality component and experience the difference Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable, suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplifying and switching signals, making this transistor versatile for different circuit designs.

Configuration: SINGLE

The single configuration simplifies the circuit design process and makes it easier to integrate into existing systems.

Package Shape: ROUND

The round package shape allows for easy mounting and soldering onto circuit boards, enhancing the ease of assembly.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operating in the ultra high frequency band, this transistor is ideal for high-speed applications and communication systems.

No. of Terminals: 3

With 3 terminals, this transistor provides flexibility in circuit connections and allows for various configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical package style makes this transistor compact and space-saving, suitable for applications with limited area.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this transistor can withstand elevated temperatures, ensuring reliability.

Maximum Collector-Base Capacitance: 0.7 pF

The low maximum collector-base capacitance of 0.7 pF minimizes signal distortion and improves high-frequency performance.

Maximum Collector-Emitter Voltage: 25 V

The maximum collector-emitter voltage of 25 V allows for safe operation in various voltage conditions, enhancing the transistor's versatility.

Transistor Element Material: SILICON

Silicon is a widely-used semiconductor material known for its reliability and efficiency, ensuring the transistor's performance and longevity.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent solderability and conductivity, facilitating easy and reliable connections in circuit assemblies.

Terminal Position: BOTTOM

With the terminal position at the bottom, this transistor allows for convenient PCB mounting and soldering, enhancing ease of installation.

Nominal Transition Frequency (fT): 650 MHz

The high nominal transition frequency of 650 MHz indicates the transistor's fast response time and suitability for high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH11RL1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.7 pF

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH11RL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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