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BFU550XVL

NXP Semiconductors

BFU550XVL by NXP Semiconductors

The NXP Semiconductors BFU550XVL is a RF BJT transistor with NPN polarity, suitable for amplifier applications in L Band frequencies up to 11GHz. It features a max collector-emitter voltage of 12V, collector current of 0.05A, and a transition frequency of 11GHz. This surface-mount transistor comes in a small outline package with Gull Wing terminals.

Median Price

$0.306

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 46 parts In-Stock

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$0.176

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Digiode

USA . 3,331 parts In-Stock

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$0.437

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$0.437

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Flip Electronics

USA . 40,000 parts In-Stock

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40,000

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Vyrian

USA . 9,179 parts In-Stock

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Anansix

USA . 2,613 parts In-Stock

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VNN

France . 2,265 parts In-Stock

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2,265

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Distributors (Availability)

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Aranea Global

USA . 500 parts In-Stock

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$0.172

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$0.166

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500

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$0.166

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Continental Prestige Electronics

USA . 2,921 parts In-Stock

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$0.176

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$0.172

2,921

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$0.172

Argo Parts USA

USA . 1,293 parts In-Stock

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$0.176

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$0.171

1,293

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Corphita

USA . 4,963 parts In-Stock

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$0.414

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$0.414

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Ampacity Inc.

Singapore . 6,735 parts In-Stock

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$0.850

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Microchip USA

USA . 13,474 parts In-Stock

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$1.009

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Kepictronics

USA . 306,000 parts In-Stock

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UNI Independent Distributors

Spain . 6,681 parts In-Stock

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Overview

Upgrade your RF amplification capabilities with the BFU550XVL by NXP Semiconductors. This high-quality NPN transistor offers unmatched performance in L Band applications, making it perfect for amplifiers. With a maximum collector-emitter voltage of 12V and a nominal transition frequency of 11000 MHz, this small outline transistor provides exceptional value and reliability. Trust NXP Semiconductors to deliver top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and lightweight housing for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product ideal for amplifier applications.

Configuration: SINGLE

The single configuration simplifies the design and integration process, making this transistor easy to use.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor ensures optimal performance in amplification circuits.

Surface Mount: YES

With surface mount capability, this transistor can be easily and securely mounted on PCBs, saving space and facilitating mass production.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and orientation on PCBs, enhancing overall circuit design.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly processes.

Highest Frequency Band: L BAND

Operating in the L band frequency range, this transistor is well-suited for high-frequency applications.

No. of Terminals: 4

With four terminals, this transistor offers multiple connection points for enhanced circuit flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it ideal for compact electronic devices.

Maximum Collector-Emitter Voltage: 12 V

The 12V maximum voltage rating ensures reliable performance and protection against voltage spikes.

Transistor Element Material: SILICON

Silicon material ensures high performance and reliability in a wide range of operating conditions.

Maximum Collector Current (IC): 0.05 A

The 0.05A maximum current rating allows for efficient power handling in various amplifier applications.

Terminal Finish: TIN

The tin terminal finish offers corrosion resistance and reliable solder joints for long-term durability.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit layout and connection options.

Maximum Time At Peak Reflow Temperature (s): 30

This transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring successful soldering processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor is compatible with standard reflow soldering processes.

Reference Standard: AEC-Q101; IEC-60134

Compliance with industry standards ensures quality and reliability in performance.

Nominal Transition Frequency (fT): 11000 MHz

The high nominal transition frequency of 11000 MHz allows for high-speed signal processing and amplification.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFU550XVL attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101; IEC-60134

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFU550XVL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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