Loading...

MPSH10RLRM

Onsemi

MPSH10RLRM by Onsemi

MPSH10RLRM by Onsemi is an NPN RF BJT with a max collector-emitter voltage of 25V and fT of 650MHz. Its package is cylindrical, suitable for ultra-high frequency applications at up to 150 °C operating temperature. Ideal for RF amplification in communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,832

-

-

-

-

Vyrian

USA . 1,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,382

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 3,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,688

-

-

-

-

TANS Electronics

Latvia . 2,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,366

-

-

-

-

SupplyDigital Components

Austria . 1,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,979

-

-

-

-

Corphita

USA . 1,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,459

-

-

-

-

Kulean Microsystems

USA . 1,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,069

-

-

-

-

Corohmni

South Africa . 148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

148

-

-

-

-

UHIMA Technologies

Türkiye . 135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

135

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the MPSH10RLRM by Onsemi. Crafted with precision and expertise, this RF Small Signal Bipolar Junction Transistor (BJT) offers unparalleled performance and reliability in ultra high frequency band applications. With a sleek cylindrical package design and NPN configuration, this transistor delivers seamless connectivity and efficiency. Elevate your projects to new heights with the Onsemi MPSH10RLRM - where quality meets innovation for unmatched results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes it lightweight and durable, suitable for portable and long-lasting applications.

Polarity or Channel Type: NPN

NPN configuration allows for fast switching speeds and low saturation voltages, making it ideal for high frequency and low power applications.

Configuration: SINGLE

Single configuration simplifies circuit design and implementation, making it easier to integrate into existing systems.

Package Shape: ROUND

The round package shape provides uniform thermal dissipation and ease of mounting, ensuring efficient performance in various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical support and secure connections, enhancing the overall reliability and stability of the transistor.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra high frequency band applications, this transistor delivers excellent performance in high-speed communication systems and RF circuits.

No. of Terminals: 3

With 3 terminals, this transistor offers versatile connectivity options for various circuit configurations, allowing for flexibility and customization.

Package Style (Meter): CYLINDRICAL

The cylindrical package style provides compact and space-saving design, making it suitable for applications where size constraints are a concern.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150 °C, this transistor can withstand high temperature environments without compromising performance.

Maximum Collector-Base Capacitance: 0.7 pF

With a low collector-base capacitance of only 0.7 pF, this transistor minimizes signal distortion and ensures high frequency response in RF applications.

Maximum Collector-Emitter Voltage: 25 V

The maximum collector-emitter voltage of 25 V provides ample headroom for voltage spikes and fluctuations, enhancing the overall reliability and robustness of the transistor.

Transistor Element Material: SILICON

Silicon transistor element material offers excellent performance characteristics, including high gain, low noise, and good temperature stability, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures reliable solder connections and corrosion resistance, enhancing the overall longevity and durability of the transistor.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, facilitating easy integration into circuit designs and reducing installation complexity.

Nominal Transition Frequency (fT): 650 MHz

With a high nominal transition frequency of 650 MHz, this transistor offers excellent high-frequency performance and fast switching speeds, making it ideal for RF and communication applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH10RLRM attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.7 pF

Maximum Collector-Emitter Voltage:

25 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH10RLRM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20