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BFT92WT/R

NXP Semiconductors

BFT92WT/R by NXP Semiconductors

The NXP Semiconductors BFT92WT/R is a PNP RF BJT transistor with 3 terminals, ideal for amplifier applications in the L Band. It has a max power dissipation of 0.3W, fT of 4000MHz, and operates at up to 150°C. This surface-mount transistor features a gull wing terminal form and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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VNN

France . 2,686 parts In-Stock

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Anansix

USA . 2,267 parts In-Stock

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Vyrian

USA . 1,369 parts In-Stock

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Digiode

USA . 683 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Ampacity Inc.

Singapore . 373 parts In-Stock

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$1.050

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Aztec Data Supply Inc.

USA . 3,568 parts In-Stock

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AZTECH Wire

Italy . 710 parts In-Stock

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One Stop Electronics

USA . 475 parts In-Stock

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$19.050

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Semicontronic

India . 258 parts In-Stock

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$63.424

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$63.098

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UNI Independent Distributors

Spain . 5,250 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Corohmni

South Africa . 485 parts In-Stock

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Bastille Electronics

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Overview

Discover unparalleled performance with the NXP Semiconductors BFT92WT/R RF Small Signal Bipolar Junction Transistor. This PNP transistor is a game-changer in the world of amplifiers, offering reliability and efficiency like no other. Its advanced design and high-quality materials make it perfect for L Band applications, ensuring top-notch performance every time. Trust NXP Semiconductors to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities in the world of electronics. Elevate your projects with the BFT92WT/R and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the transistor.

Polarity or Channel Type: PNP

PNP polarity enables easy integration into PNP transistor circuits.

Configuration: SINGLE

Single configuration simplifies circuit design and implementation.

Transistor Application: AMPLIFIER

Designed for amplifier applications, providing reliable signal amplification.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular package shape allows for compact and efficient PCB layout.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and mounting on the PCB.

Highest Frequency Band: L BAND

Designed for operation in the L band frequency range, suitable for various RF applications.

No. of Terminals: 3

3 terminals provide necessary connections for proper transistor operation.

Maximum Power Dissipation (Abs): 0.3 W

High absolute maximum power dissipation allows for reliable operation under varying load conditions.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers space-saving benefits in circuit design.

Maximum Power Dissipation Ambient: 0.3 W

Maintaining maximum power dissipation even in ambient conditions ensures stable performance.

Minimum DC Current Gain (hFE): 20

Minimum DC current gain of 20 ensures sufficient amplification capabilities in the circuit.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for operation in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 15 V

Maximum collector-emitter voltage rating of 15V ensures safe operation in the circuit.

Transistor Element Material: SILICON

Silicon transistor element material provides reliability and consistent performance.

Maximum Collector Current (IC): 0.025 A

Maximum collector current rating of 0.025A allows for handling varying current loads.

Terminal Finish: TIN

Tin terminal finish offers good solderability and electrical conductivity.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB mounting options.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable solder joints during assembly.

Nominal Transition Frequency (fT): 4000 MHz

High nominal transition frequency of 4000MHz indicates excellent high-frequency performance.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFT92WT/R attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

HIGH RELIABILITY

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

20

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation Ambient:

.3 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFT92WT/R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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