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BFT92

Infineon Technologies

BFT92 by Infineon Technologies

PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 5000 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .045 A;

Median Price

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Lifecycle Status

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USA . 5,500 parts In-Stock

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Cyclops Electronics Ltd

UK . 4,500 parts In-Stock

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VNN

France . 3,571 parts In-Stock

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Vyrian

USA . 1,343 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,263 parts In-Stock

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Anansix

USA . 1,065 parts In-Stock

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Digiode

USA . 993 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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LWI Electronics Inc

India . 370 parts In-Stock

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370

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Speed Components Ltd

Israel . 196 parts In-Stock

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Sensible Micro Corp

USA . 65 parts In-Stock

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J2 Sourcing AB

Sweden . 63 parts In-Stock

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ABC Electronics Ltd.

UK . 63 parts In-Stock

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Bristol Electronics

USA . 63 parts In-Stock

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Atlantic Semiconductor

USA . 63 parts In-Stock

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LittleDiode

UK . 26 parts In-Stock

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Manotoh

Italy . 23 parts In-Stock

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A2Z Electronics, Inc.

USA . 14 parts In-Stock

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Huijzer Components

Netherlands . 4 parts In-Stock

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Halfin

Belgium . 1 parts In-Stock

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Modulus Dynamics

Lithuania . 2,474 parts In-Stock

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$0.417

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$0.400

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$0.384

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Aztec Data Supply Inc.

USA . 3,201 parts In-Stock

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$0.660

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Corohmni

South Africa . 357 parts In-Stock

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$0.852

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.375

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AZTECH Wire

Italy . 225 parts In-Stock

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$5.536

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One Stop Electronics

USA . 1,578 parts In-Stock

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Semicontronic

India . 1,205 parts In-Stock

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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Assy Fe

Spain . 28,729 parts In-Stock

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Perfect Parts

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Futuretech Components

Singapore . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,672 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Argo Parts USA

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Corphita

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Speed Components Ltd (Excess)

Israel . 2,378 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,003 parts In-Stock

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Continental Prestige Electronics

USA . 447 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFT92 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.9 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

20

Highest Frequency Band:

L BAND

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFT92 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-422-7412, 5961014227412

NIIN

014227412

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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