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BFT93,215

NXP Semiconductors

BFT93,215 by NXP Semiconductors

NXP Semiconductors' BFT93,215 is a PNP RF BJT transistor with 3 terminals. It operates in the ultra-high frequency band up to 5000 MHz and has a max power dissipation of 0.3W. Ideal for amplifier applications, it features a small outline package with gull wing terminals for surface mounting.

Median Price

$0.360

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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DF Sales Co.

USA . 980 parts In-Stock

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$0.360

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980

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DF Sales Co.

USA . 980 parts In-Stock

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$0.360

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980

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Vyrian

USA . 6,752 parts In-Stock

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6,752

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Anansix

USA . 2,849 parts In-Stock

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2,849

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Digiode

USA . 2,441 parts In-Stock

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2,441

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VNN

France . 800 parts In-Stock

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800

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Prism Electronics

USA . 217 parts In-Stock

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Nova Conductors

Japan . 97 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,804 parts In-Stock

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$0.867

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$0.867

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Modulus Dynamics

Lithuania . 23,245 parts In-Stock

1+ parts

$1.736

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$1.736

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$1.736

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23,245

$1.736

$1.736

$1.736

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Corohmni

South Africa . 930 parts In-Stock

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$1.768

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930

$1.768

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One Stop Electronics

USA . 694 parts In-Stock

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$3.050

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694

$3.050

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AZTECH Wire

Italy . 679 parts In-Stock

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$7.019

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679

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Ampacity Inc.

Singapore . 1,085 parts In-Stock

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$57.050

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Perfect Parts

USA . 5,542 parts In-Stock

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Corphita

USA . 3,645 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 834 parts In-Stock

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Continental Prestige Electronics

USA . 738 parts In-Stock

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UNI Independent Distributors

Spain . 546 parts In-Stock

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Microchip USA

USA . 186 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of the BFT93,215 by NXP Semiconductors, a leading manufacturer in the industry. This RF Small Signal Bipolar Junction Transistor (BJT) is perfect for amplifier applications in the ultra-high frequency band. With its single configuration and compact design, this PNP transistor offers exceptional performance and efficiency. Trust NXP Semiconductors to deliver cutting-edge technology that meets your needs, providing you with the value and benefits you deserve. Elevate your projects with the BFT93,215 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and thermal stability, making the transistor suitable for various applications.

Polarity or Channel Type: PNP

PNP transistors are commonly used in high-side switching applications, making this transistor versatile for different circuit designs.

Configuration: SINGLE

Single configuration simplifies circuit design and installation, reducing complexity and potential errors.

Transistor Application: AMPLIFIER

Designed for amplifier applications, this transistor offers high gain and low noise characteristics for signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and compact PCB layout, saving space and facilitating automated assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient placement on the circuit board, optimizing space utilization for densely packed designs.

Terminal Form: GULL WING

Gull wing terminals provide secure solder connections and mechanical strength, enhancing the reliability and longevity of the transistor.

Maximum Collector-Emitter Voltage: 12 V

With a maximum voltage rating of 12V, this transistor can safely handle a wide range of voltage levels in various circuit applications.

Nominal Transition Frequency (fT): 5000 MHz

High transition frequency of 5000 MHz indicates excellent high-frequency performance, making this transistor ideal for high-speed signal processing.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFT93,215 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

20

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation Ambient:

.3 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

CECC

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFT93,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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