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BFT93W,115

NXP Semiconductors

BFT93W,115 by NXP Semiconductors

The NXP BFT93W,115 is a PNP RF BJT transistor with 3 terminals and a max power dissipation of 0.3 W. It operates in the L band with a transition frequency of 4000 MHz, making it ideal for amplifier applications in high-frequency circuits. The small outline package and surface-mount capability enhance its versatility in compact electronic designs.

Median Price

$0.283

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 36 parts In-Stock

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$0.283

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36

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Vyrian

USA . 8,129 parts In-Stock

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8,129

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LIBRA Elektronik GmbH

Germany . 1,987 parts In-Stock

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VNN

France . 928 parts In-Stock

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Anansix

USA . 635 parts In-Stock

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635

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Digiode

USA . 600 parts In-Stock

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600

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Distributors (Availability)

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Aranea Global

USA . 100 parts In-Stock

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$0.277

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$0.266

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100

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Argo Parts USA

USA . 4,583 parts In-Stock

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$0.283

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$0.275

4,583

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$0.275

Continental Prestige Electronics

USA . 4,231 parts In-Stock

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$0.283

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$0.277

4,231

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Corohmni

South Africa . 473 parts In-Stock

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$0.283

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473

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Aztec Data Supply Inc.

USA . 4,570 parts In-Stock

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$1.085

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$1.085

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Semicontronic

India . 1,498 parts In-Stock

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$6.050

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$5.899

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$5.868

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1,498

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Ampacity Inc.

Singapore . 645 parts In-Stock

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$12.050

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645

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AZTECH Wire

Italy . 231 parts In-Stock

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$19.329

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One Stop Electronics

USA . 244 parts In-Stock

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$35.050

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244

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Corphita

USA . 3,604 parts In-Stock

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Perfect Parts

USA . 2,754 parts In-Stock

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Microchip USA

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UNI Independent Distributors

Spain . 232 parts In-Stock

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Overview

Enhance your electronic designs with the BFT93W,115 by NXP Semiconductors, a top-of-the-line RF Small Signal Bipolar Junction Transistor. Manufactured with precision and quality, this PNP transistor is perfect for amplifier applications in the L Band frequency. Its small outline package and gull wing terminals make it easy to integrate into your projects. With a minimum DC current gain of 20 and a maximum operating temperature of 150°C, this transistor offers superior performance and reliability. Elevate your projects with the BFT93W,115 and experience seamless functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications and environments.

Polarity or Channel Type: PNP

The PNP configuration allows for ease of integration in certain circuit designs and applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and makes the transistor easy to use.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplification tasks.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape aids in PCB layout and integration.

No. of Terminals: 3

Having 3 terminals provides necessary connections for proper operation.

Maximum Power Dissipation (Abs): 0.3 W

High power dissipation capability ensures reliable and stable operation.

Package Style (Meter): SMALL OUTLINE

Small outline package makes it suitable for compact and space-constrained designs.

Maximum Power Dissipation Ambient: 0.3 W

Efficient power dissipation in ambient conditions ensures reliability in operation.

Minimum DC Current Gain (hFE): 20

Minimum DC current gain ensures consistent performance in amplifier circuits.

Maximum Operating Temperature: 150 °C

High operating temperature threshold allows for use in demanding environments.

Maximum Collector-Emitter Voltage: 12 V

A high collector-emitter voltage rating provides versatility in circuit design.

Transistor Element Material: SILICON

Silicon material ensures stable and reliable transistor performance.

Maximum Collector Current (IC): 0.05 A

Able to handle moderate collector current for various applications.

Terminal Finish: TIN

TIN terminal finish offers good conductivity and solderability.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds during assembly.

Peak Reflow Temperature °C: 260

Can withstand high peak reflow temperature during PCB assembly process.

Nominal Transition Frequency (fT): 4000 MHz

High transition frequency enables high-frequency signal amplification with minimal distortion.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFT93W,115 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

HIGH RELIABILITY

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

20

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation Ambient:

.3 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFT93W,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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