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MPSH81RL1

Onsemi

MPSH81RL1 by Onsemi

MPSH81RL1 by Onsemi is a PNP RF BJT transistor with 3 terminals. It has a max collector-emitter voltage of 20V, fT of 600MHz, and operates up to 150 °C. Ideal for amplifier applications due to its high transition frequency and low collector-base capacitance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,363 parts In-Stock

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Digiode

USA . 335 parts In-Stock

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335

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Kulean Microsystems

USA . 7,720 parts In-Stock

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SupplyDigital Components

Austria . 4,317 parts In-Stock

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TANS Electronics

Latvia . 1,971 parts In-Stock

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Problanco Electronics

Mexico . 1,191 parts In-Stock

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Corphita

USA . 967 parts In-Stock

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UHIMA Technologies

Türkiye . 748 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Discover the power of the MPSH81RL1 by Onsemi, a cutting-edge RF Small Signal Bipolar Junction Transistor that offers unparalleled quality and performance. With Onsemi's renowned reputation for innovation and reliability, this transistor is perfect for amplifier applications, delivering exceptional value and benefits to customers. Whether you're looking to amplify signals or enhance your electronic projects, the MPSH81RL1 provides unmatched advantages in a compact, easy-to-use package. Elevate your designs with Onsemi's superior technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: PNP

Suitable for applications where a PNP transistor is required for proper circuit operation.

Configuration: SINGLE

Simplified design and implementation in circuits that require a single transistor configuration.

Transistor Application: AMPLIFIER

Specifically designed for amplification purposes, ensuring reliable and efficient performance in amplifier circuits.

Package Shape: ROUND

Space-saving design that allows for efficient use of board space in compact electronic devices.

Terminal Form: THROUGH-HOLE

Facilitates easy installation and soldering on printed circuit boards, making it convenient for assembly.

No. of Terminals: 3

Simplifies connection requirements and reduces complexity in circuits that only require three terminals.

Package Style (Meter): CYLINDRICAL

Provides a standardized package style that is easy to mount and integrate into various electronic systems.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for applications that require elevated operating conditions.

Maximum Collector-Base Capacitance: 0.85 pF

Low capacitance value minimizes the effect on high-frequency signals, ensuring accurate amplification.

Maximum Collector-Emitter Voltage: 20 V

Withstands high voltage levels, making it suitable for applications that require higher voltage handling capabilities.

Transistor Element Material: SILICON

Offers reliable performance and stability due to the properties of silicon as a semiconductor material.

Terminal Finish: TIN LEAD

Provides a secure and reliable connection between the transistor and the circuit, ensuring minimal signal loss.

Terminal Position: BOTTOM

Facilitates easy mounting and connection in a circuit layout, allowing for efficient routing of connections.

Nominal Transition Frequency (fT): 600 MHz

High-frequency capability allows for fast signal switching and amplification, making it suitable for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH81RL1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.85 pF

Maximum Collector-Emitter Voltage:

20 V

Configuration:

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH81RL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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