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MMBT5770

Onsemi

MMBT5770 by Onsemi

The Onsemi MMBT5770 is an NPN RF BJT transistor with a max collector-emitter voltage of 15V and fT of 600MHz. Ideal for amplifier applications, it comes in a small outline package with Gull Wing terminals for surface mounting. With a min hFE of 30, it offers 0.225W power dissipation and 0.00009A max collector current.

Median Price

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Lifecycle Status

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6

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1k+

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ACDS - Activité Composants Distribution Service

France . 6,000 parts In-Stock

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Bristol Electronics

USA . 6,000 parts In-Stock

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Dan-Mar Components

USA . 6,000 parts In-Stock

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PC Components Company LLC

USA . 3,000 parts In-Stock

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Vyrian

USA . 2,300 parts In-Stock

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Digiode

USA . 1,131 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$1.110

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$1.010

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$0.910

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350

$1.110

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Component Stockers USA

USA . 3,840 parts In-Stock

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$10.060

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$9.560

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$9.260

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Kepictronics

USA . 306,000 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,608 parts In-Stock

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TANS Electronics

Latvia . 7,935 parts In-Stock

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SupplyDigital Components

Austria . 7,070 parts In-Stock

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Problanco Electronics

Mexico . 2,809 parts In-Stock

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Corphita

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Supply Digital

USA . 875 parts In-Stock

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UHIMA Technologies

Türkiye . 621 parts In-Stock

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Kulean Microsystems

USA . 259 parts In-Stock

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Corohmni

South Africa . 206 parts In-Stock

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Overview

Enhance your electronic projects with the MMBT5770 by Onsemi, a top-quality RF Small Signal Bipolar Junction Transistor. Manufactured with precision and expertise by Onsemi, this NPN transistor is perfect for amplifier applications. Its small outline package and gull wing terminals make it easy to mount and use, while its high transition frequency of 600 MHz ensures smooth performance. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits that the MMBT5770 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Simplifies circuit design and makes it easier to integrate into electronic devices.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplification circuits.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Compact shape that is suitable for small outline packages, making it ideal for space-constrained applications.

Maximum Power Dissipation (Abs): 0.225 W

Can handle moderate power levels, suitable for various low-power applications.

Minimum DC Current Gain (hFE): 30

Provides consistent and reliable amplification of input signals.

Maximum Collector-Emitter Voltage: 15 V

Can withstand higher voltage levels, making it versatile for different voltage requirements.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, ensuring long-term operation.

Maximum Collector Current (IC): 0.00009 A

Can handle low current levels, suitable for low-power applications.

Terminal Finish: MATTE TIN

Provides a high-quality finish for soldering, ensuring reliable electrical connections.

Nominal Transition Frequency (fT): 600 MHz

High transition frequency allows for efficient amplification of higher frequency signals.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBT5770 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

30

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP RF Small Signal

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBT5770 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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