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55GN01FA

Onsemi

55GN01FA by Onsemi

55GN01FA by Onsemi is a NPN BJT transistor with 3 terminals, suitable for amplifier applications in the UHF band. It has a max power dissipation of 0.25W, hFE of 100, and fT of 5500MHz. The package is small outline plastic/epoxy with dual terminal position and can operate up to 150 °C.

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1k+

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Digiode

USA . 1,207 parts In-Stock

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USA . 792 parts In-Stock

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Northwest PG Solutions

USA . 40 parts In-Stock

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SupplyDigital Components

Austria . 6,743 parts In-Stock

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Problanco Electronics

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TANS Electronics

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Corphita

USA . 1,482 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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Native Components

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Corohmni

South Africa . 154 parts In-Stock

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Overview

Unlock the power of innovation with the 55GN01FA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality RF Small Signal Bipolar Junction Transistors that are perfect for amplifier applications in the ultra-high-frequency band. With a single configuration and NPN polarity, this transistor offers a seamless integration for your projects. Experience the benefits of high reliability, excellent performance, and outstanding value with the 55GN01FA. Elevate your designs and achieve unmatched results with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the transistor and ensures durability in various operating conditions.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifier circuits, making this product suitable for amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and integration, making it easier to use in electronic devices.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in amplifying signals.

Surface Mount: YES

Surface mount packaging allows for easy and efficient installation on circuit boards, reducing assembly time and costs.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, ideal for space-constrained electronic devices.

Terminal Form: FLAT

Flat terminals make soldering easier and more secure, ensuring a reliable connection in the circuit.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Operates in the ultra-high frequency band, suitable for high-frequency applications such as telecommunications and RF circuits.

No. of Terminals: 3

Three terminals offer flexibility in circuit design and compatibility with various electronic devices.

Maximum Power Dissipation (Abs): 0.25 W

Can handle up to 0.25 watts of power dissipation, making it suitable for low to medium power applications.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space and allows for high-density mounting on PCBs.

Minimum DC Current Gain (hFE): 100

A minimum DC current gain of 100 ensures sufficient amplification of signals in various electronic circuits.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150 °C, suitable for a wide range of operating environments.

Maximum Collector-Base Capacitance: 1.2 pF

Low collector-base capacitance of 1.2 pF minimizes signal distortion and interference in high-frequency applications.

Maximum Collector-Emitter Voltage: 10 V

Can withstand a maximum collector-emitter voltage of 10 volts, suitable for low voltage applications.

Transistor Element Material: SILICON

Silicon material ensures high performance, reliability, and stability in various electronic applications.

Maximum Collector Current (IC): 0.07 A

Maximum collector current of 0.07 A allows for moderate current handling capabilities in the circuit.

Terminal Position: DUAL

Dual terminal position provides ease of connection and compatibility with various circuit configurations.

Nominal Transition Frequency (fT): 5500 MHz

High nominal transition frequency of 5500 MHz ensures efficient amplification and high-speed signal processing.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) 55GN01FA attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.2 pF

Maximum Collector-Emitter Voltage:

10 V

Configuration:

Minimum DC Current Gain (hFE):

100

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-F3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

55GN01FA Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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