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BFR106E6327

Infineon Technologies

BFR106E6327 by Infineon Technologies

BFR106E6327 by Infineon Technologies is an NPN RF Small Signal BJT with a max operating temperature of 150°C. It has a min DC current gain of 40 and a nominal transition frequency of 5000 MHz, making it ideal for amplifier applications. This transistor comes in a small outline package with gull wing terminals for surface mount assembly.

Median Price

$0.593

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,859 parts In-Stock

1+ parts

$1.140

100+ parts

$0.499

1k+ parts

$0.233

10k+ parts

$0.152

5,859

$1.140

$0.499

$0.233

$0.152

Chip1Stop

Japan . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.097

42,000

-

-

-

$0.097

Verical

USA . 138 parts In-Stock

1+ parts

-

100+ parts

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$0.593

10k+ parts

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138

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-

$0.593

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 481 parts In-Stock

1+ parts

$0.097

100+ parts

-

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481

$0.097

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TME

Poland . 1,402 parts In-Stock

1+ parts

$0.300

100+ parts

$0.151

1k+ parts

$0.131

10k+ parts

$0.121

1,402

$0.300

$0.151

$0.131

$0.121

Digiode

USA . 442 parts In-Stock

1+ parts

$0.408

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-

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442

$0.408

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ComSIT USA

USA . 7,227 parts In-Stock

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7,227

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ComSIT Distribution GmbH

Germany . 3,235 parts In-Stock

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3,235

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Rutronik

Germany . 3,000 parts In-Stock

1+ parts

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$0.109

3,000

-

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-

$0.109

ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

1+ parts

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3,000

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ECAB

Sweden . 3,000 parts In-Stock

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Standard Data Resources

USA . 2,514 parts In-Stock

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2,514

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Sea View Technologies

USA . 1,051 parts In-Stock

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1,051

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Bristol Electronics

USA . 1,051 parts In-Stock

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1,051

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Prism Electronics

USA . 107 parts In-Stock

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107

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

CoreStaff

Japan . 258 parts In-Stock

1+ parts

$0.077

100+ parts

$0.071

1k+ parts

$0.071

10k+ parts

-

258

$0.077

$0.071

$0.071

-

Native Components

USA . 226 parts In-Stock

1+ parts

$0.290

100+ parts

-

1k+ parts

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10k+ parts

$0.279

226

$0.290

-

-

$0.279

Northwest PG Solutions

USA . 252 parts In-Stock

1+ parts

$0.319

100+ parts

-

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$0.282

252

$0.319

-

-

$0.282

Corphita

USA . 905 parts In-Stock

1+ parts

$0.387

100+ parts

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905

$0.387

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Modulus Dynamics

Lithuania . 12,153 parts In-Stock

1+ parts

$1.933

100+ parts

$1.856

1k+ parts

$1.778

10k+ parts

-

12,153

$1.933

$1.856

$1.778

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Andel Nordic

Denmark . 644 parts In-Stock

1+ parts

$19.040

100+ parts

-

1k+ parts

$13.330

10k+ parts

$13.330

644

$19.040

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$13.330

$13.330

A-Z Elektronik GmbH

Germany . 8,220 parts In-Stock

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Lixinc

USA . 8,142 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Cyclops Electronics Ltd (Excess)

UK . 3,000 parts In-Stock

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Kepictronics

USA . 1,700 parts In-Stock

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1,700

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Enhance your electronic projects with the BFR106E6327 by Infineon Technologies, a top-quality RF Small Signal Bipolar Junction Transistor (BJT) that guarantees exceptional performance and reliability. With a focus on innovation and cutting-edge technology, Infineon Technologies delivers products that exceed industry standards. Ideal for amplifier applications, this NPN transistor offers high value and efficiency, making it a smart choice for customers looking to elevate their designs. Trust in the trusted name of Infineon Technologies and experience the advantages of the BFR106E6327 in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides good insulation and protection for the transistor, increasing its durability and reliability.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifiers and other electronic applications, making this product versatile and suitable for a wide range of uses.

Configuration: SINGLE

Single configuration makes the transistor easy to use and integrate into circuits, simplifying the design process.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor ensures high performance and efficiency in amplification tasks.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards, making this transistor ideal for compact electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used for small outline transistors, providing a compact and efficient design for various electronic applications.

No. of Terminals: 3

Three terminals offer flexible connectivity options and enable the transistor to be used in different circuit configurations.

Maximum Power Dissipation (Abs): 0.7 W

High power dissipation capability of 0.7W allows the transistor to handle relatively high power levels without overheating or performance degradation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and provides a compact design for portable electronic devices.

Minimum DC Current Gain (hFE): 40

Minimum DC current gain of 40 ensures stable and reliable amplification performance in various operating conditions.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150°C allows the transistor to function effectively in demanding thermal environments.

Maximum Collector-Base Capacitance: 1.5 pF

Low collector-base capacitance of 1.5 pF minimizes signal distortion and interference, ensuring high signal integrity in amplification tasks.

Maximum Collector-Emitter Voltage: 15 V

Maximum collector-emitter voltage of 15V offers reliable protection against voltage spikes and fluctuations, enhancing the transistor's durability.

Transistor Element Material: SILICON

Silicon material for the transistor element provides stable and consistent performance, making it a reliable choice for electronic applications.

Maximum Collector Current (IC): 0.1 A

Maximum collector current of 0.1A allows the transistor to handle moderate current loads, suitable for a wide range of amplification tasks.

Terminal Finish: MATTE TIN

Matte tin finish on terminals offers good conductivity and solderability, ensuring secure connections and stable performance in electronic circuits.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and connectivity options, allowing for versatile integration into electronic systems.

Maximum Time At Peak Reflow Temperature (s): 40

Maximum time at peak reflow temperature of 40 seconds ensures proper soldering and thermal stability during assembly processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C enables reliable soldering and mounting of the transistor on circuit boards.

Nominal Transition Frequency (fT): 5000 MHz

High nominal transition frequency of 5000 MHz indicates fast switching speeds and high-frequency performance, making the transistor suitable for high-speed applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR106E6327 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.5 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

40

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR106E6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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