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BFR193E6327HTSA1

Infineon Technologies

BFR193E6327HTSA1 by Infineon Technologies

BFR193E6327HTSA1 by Infineon Technologies is an NPN RF BJT transistor with a max operating temperature of 150°C. It has a min DC current gain of 70 and operates in the ultra-high frequency band up to 8000 MHz. This transistor is commonly used as an amplifier in applications requiring high-frequency signal amplification.

Median Price

$0.096

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Distrelec

Netherlands . 2,925 parts In-Stock

1+ parts

$0.475

100+ parts

$0.432

1k+ parts

$0.345

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2,925

$0.475

$0.432

$0.345

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Arrow

USA . 606,000 parts In-Stock

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$0.062

606,000

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$0.062

EBV Elektronik

Germany . 33,000 parts In-Stock

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33,000

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Element14

Singapore . 31,966 parts In-Stock

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$0.137

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$0.105

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$0.104

31,966

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$0.137

$0.105

$0.104

Avnet

USA . 18,000 parts In-Stock

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$0.091

18,000

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$0.091

Farnell

UK . 14,965 parts In-Stock

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$0.178

1k+ parts

$0.137

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$0.113

14,965

-

$0.178

$0.137

$0.113

Chip1Stop

Japan . 13,796 parts In-Stock

1+ parts

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100+ parts

$0.069

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$0.069

10k+ parts

$0.067

13,796

-

$0.069

$0.069

$0.067

Future Electronics

Canada . 3,000 parts In-Stock

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$0.096

3,000

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$0.096

Verical

USA . 3,000 parts In-Stock

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$0.088

3,000

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$0.088

RS (Exports)

UK . 2,200 parts In-Stock

1+ parts

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$0.138

10k+ parts

$0.121

2,200

-

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$0.121

Distributors (In-Stock)

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Digiode

USA . 482 parts In-Stock

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$0.051

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482

$0.051

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Nova Conductors

Japan . 10 parts In-Stock

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$0.112

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10

$0.112

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Maritex

Poland . 14,250 parts In-Stock

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$0.160

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$0.160

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Vyrian

USA . 102,685 parts In-Stock

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102,685

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NAC Semi

USA . 72,000 parts In-Stock

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$0.243

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$0.243

Chip Stock

USA . 69,870 parts In-Stock

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69,870

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Rutronik

Germany . 27,000 parts In-Stock

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$0.083

27,000

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$0.083

IBS Electronics

USA . 9,000 parts In-Stock

1+ parts

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$0.136

9,000

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$0.136

TME

Poland . 3,079 parts In-Stock

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$0.126

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3,079

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$0.126

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VNN

France . 1,990 parts In-Stock

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1,990

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Partservice

France . 980 parts In-Stock

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$0.099

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$0.099

980

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$0.099

$0.099

Micros sp.j. W. Kędra i J. Lic

Poland . 980 parts In-Stock

1+ parts

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100+ parts

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$0.106

10k+ parts

$0.106

980

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-

$0.106

$0.106

Schukat

Germany . 300 parts In-Stock

1+ parts

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100+ parts

$0.102

1k+ parts

$0.070

10k+ parts

$0.068

300

-

$0.102

$0.070

$0.068

Elcom Components

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 126,963 parts In-Stock

1+ parts

$0.046

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Corphita

USA . 499 parts In-Stock

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$0.049

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499

$0.049

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Aranea Global

USA . 1,000 parts In-Stock

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$0.110

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$0.105

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1,000

$0.110

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Argo Parts USA

USA . 673 parts In-Stock

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$0.112

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$0.109

673

$0.112

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$0.109

Component Stockers USA

USA . 688,957 parts In-Stock

1+ parts

$0.370

100+ parts

$0.130

1k+ parts

$0.090

10k+ parts

$0.060

688,957

$0.370

$0.130

$0.090

$0.060

Modulus Dynamics

Lithuania . 4,417 parts In-Stock

1+ parts

$1.009

100+ parts

$0.969

1k+ parts

$0.928

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4,417

$1.009

$0.969

$0.928

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Epart123

USA . 150,000 parts In-Stock

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$0.150

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Continental Prestige Electronics

USA . 35,442 parts In-Stock

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$0.140

1k+ parts

$0.088

10k+ parts

$0.076

35,442

-

$0.140

$0.088

$0.076

Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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Perfect Parts

USA . 25,271 parts In-Stock

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25,271

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RC Electronics

USA . 20,000 parts In-Stock

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$0.120

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$0.110

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$0.110

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$0.110

Lixinc

USA . 15,667 parts In-Stock

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15,667

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A-Z Elektronik GmbH

Germany . 9,000 parts In-Stock

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9,000

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QUARKTWIN TECHNOLOGY LTD

USA . 5,282 parts In-Stock

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5,282

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iodParts Technologies Inc.

India . 3,330 parts In-Stock

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3,330

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Overview

Unlock the full potential of your RF applications with the BFR193E6327HTSA1 by Infineon Technologies. This high-quality NPN transistor offers unmatched performance in the ultra-high frequency band, making it ideal for amplifier circuits. With a small outline package and gull wing terminals, this transistor is easy to work with and ensures reliable operation. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds your expectations. Elevate your projects with the BFR193E6327HTSA1 - the ultimate choice for professionals who demand excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are widely used in amplification and switching applications, providing versatility in circuit design.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easy to use in various amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and efficient mounting on PCBs, saving space and improving manufacturing processes.

Package Shape: RECTANGULAR

Rectangular package shape is compact and easy to handle, making it ideal for use in small outline applications.

Terminal Form: GULL WING

Gull wing terminals provide secure electrical connections and ease of soldering during assembly.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Nominal Transition Frequency (fT): 8000 MHz

High nominal transition frequency enables fast switching speeds and high-frequency applications, making it suitable for ultra-high-frequency bands.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR193E6327HTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1 pF

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

70

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR193E6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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