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BFR182WH6327XTSA1

Infineon Technologies

BFR182WH6327XTSA1 by Infineon Technologies

BFR182WH6327XTSA1 by Infineon is a NPN RF BJT transistor with 8000 MHz fT. It has a max collector-emitter voltage of 12V and 0.035A max collector current. Ideal for amplifier applications in L Band frequencies, it comes in a small outline package with gull wing terminals for surface mount assembly.

Median Price

$0.183

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,560 parts In-Stock

1+ parts

$0.049

100+ parts

$0.046

1k+ parts

$0.041

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1,560

$0.049

$0.046

$0.041

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Arrow

USA . 57 parts In-Stock

1+ parts

$0.098

100+ parts

$0.095

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57

$0.098

$0.095

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DigiKey

USA . 24,534 parts In-Stock

1+ parts

$0.310

100+ parts

$0.164

1k+ parts

$0.137

10k+ parts

$0.121

24,534

$0.310

$0.164

$0.137

$0.121

Newark

USA . 1,511 parts In-Stock

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$0.319

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$0.182

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1,511

$0.319

$0.182

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Distrelec

Netherlands . 2,995 parts In-Stock

1+ parts

$0.472

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$0.332

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$0.204

10k+ parts

$0.182

2,995

$0.472

$0.332

$0.204

$0.182

Chip1Stop

Japan . 5,650 parts In-Stock

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Verical

USA . 5,650 parts In-Stock

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$0.181

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$0.147

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$0.128

5,650

-

$0.181

$0.147

$0.128

Farnell

UK . 2,321 parts In-Stock

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$0.162

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$0.116

10k+ parts

$0.109

2,321

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$0.162

$0.116

$0.109

Element14

Singapore . 2,321 parts In-Stock

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$0.185

10k+ parts

$0.172

2,321

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$0.185

$0.172

Distributors (In-Stock)

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Digiode

USA . 985 parts In-Stock

1+ parts

$0.047

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985

$0.047

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Nova Conductors

Japan . 100 parts In-Stock

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$0.089

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100

$0.089

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TME

Poland . 1,885 parts In-Stock

1+ parts

$0.290

100+ parts

$0.150

1k+ parts

$0.117

10k+ parts

$0.111

1,885

$0.290

$0.150

$0.117

$0.111

Vyrian

USA . 18,108 parts In-Stock

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Rutronik

Germany . 6,000 parts In-Stock

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$0.117

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$0.117

NAC Semi

USA . 6,000 parts In-Stock

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$0.429

6,000

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$0.429

ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

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Bristol Electronics

USA . 3,000 parts In-Stock

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Partservice

France . 2,980 parts In-Stock

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$0.086

10k+ parts

$0.067

2,980

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-

$0.086

$0.067

Micros sp.j. W. Kędra i J. Lic

Poland . 2,980 parts In-Stock

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100+ parts

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$0.092

10k+ parts

$0.071

2,980

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$0.092

$0.071

ComSIT Distribution GmbH

Germany . 2,171 parts In-Stock

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VNN

France . 350 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 18,164 parts In-Stock

1+ parts

$0.037

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$0.037

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Corphita

USA . 590 parts In-Stock

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$0.044

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590

$0.044

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Argo Parts USA

USA . 286 parts In-Stock

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$0.089

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$0.086

286

$0.089

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$0.086

Continental Prestige Electronics

USA . 20,447 parts In-Stock

1+ parts

$0.282

100+ parts

$0.103

1k+ parts

$0.059

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$0.039

20,447

$0.282

$0.103

$0.059

$0.039

Modulus Dynamics

Lithuania . 2,992 parts In-Stock

1+ parts

$0.455

100+ parts

$0.437

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$0.419

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2,992

$0.455

$0.437

$0.419

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Corohmni

South Africa . 62 parts In-Stock

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$0.871

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62

$0.871

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Aztec Data Supply Inc.

USA . 3,877 parts In-Stock

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$1.177

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Perfect Parts

USA . 13,608 parts In-Stock

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Glotronic Ltd.

UK . 12,000 parts In-Stock

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GreenTree Electronics

Israel . 9,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the BFR182WH6327XTSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and reliability. This RF Small Signal Bipolar Junction Transistor (BJT) is a game-changer in the world of amplifiers, offering unparalleled performance in the L Band frequency range. With its easy-to-mount surface design and NPN configuration, this transistor is perfect for a wide range of applications. Experience seamless connectivity and enhanced signal processing with the BFR182WH6327XTSA1, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable applications.

Polarity or Channel Type: NPN

NPN configuration allows for easy integration with other components in the circuit, making it versatile for a variety of applications.

Configuration: SINGLE

The single configuration simplifies circuit design and assembly, reducing the overall complexity and cost of the system.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort in manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient, making it suitable for compact designs with limited board space.

Terminal Form: GULL WING

Gull wing terminal form ensures secure connections and reliable performance in various operating conditions.

Highest Frequency Band: L BAND

Suitable for L band frequencies, this transistor is ideal for use in communication and radar systems operating in this frequency range.

No. of Terminals: 3

With 3 terminals, this transistor offers simple connectivity and compatibility with standard circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Maximum Collector-Base Capacitance: 0.5 pF

Low collector-base capacitance ensures minimal signal distortion and improved high-frequency performance.

Maximum Collector-Emitter Voltage: 12 V

With a 12V collector-emitter voltage rating, this transistor can handle higher voltage levels without breakdown, enhancing reliability.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability, making the transistor suitable for a wide range of operating conditions.

Maximum Collector Current (IC): 0.035 A

With a maximum collector current of 0.035A, this transistor can handle moderate power levels, making it versatile for various applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and ensures reliable solder connections for long-term performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and connection options, enhancing ease of integration.

Reference Standard: AEC-Q101

Compliant with AEC-Q101 automotive quality standards, guaranteeing high reliability and performance in automotive applications.

Nominal Transition Frequency (fT): 8000 MHz

High transition frequency of 8000MHz ensures fast response times and excellent high-frequency performance for demanding applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR182WH6327XTSA1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.5 pF

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR182WH6327XTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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