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MMBT5771

Onsemi

MMBT5771 by Onsemi

Onsemi's MMBT5771 is a PNP RF BJT transistor with 3 terminals, ideal for switching applications. With a max power dissipation of 0.35W and max operating temp of 150 °C, it offers high performance in a small outline package. Featuring a max collector-emitter voltage of 15V and transition frequency of 700MHz, it suits various RF signal amplification needs.

Median Price

$2.000

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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DigiKey

USA . 13,182 parts In-Stock

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Flip Electronics (Authorized)

USA . 13,182 parts In-Stock

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Component Electronics Inc.

Canada . 2,070 parts In-Stock

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$1.540

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$1.150

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$1.000

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$1.540

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Vyrian

USA . 2,834 parts In-Stock

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Forefront Electronics and Design

USA . 9 parts In-Stock

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$2.450

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Flip Electronics

USA . 13,182 parts In-Stock

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DigiKey Marketplace

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Chip Stock

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ComSIT Distribution GmbH

Germany . 2,840 parts In-Stock

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ComSIT USA

USA . 2,840 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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Anansix

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Diverse Electronics

Canada . 1,271 parts In-Stock

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Digiode

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R&J Components

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North Shore Components

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First Choice Components Inc.

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ACDS - Activité Composants Distribution Service

France . 240 parts In-Stock

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Semi Source

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Resion

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Prism Electronics

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LittleDiode

UK . 7 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$1.470

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$1.338

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$1.205

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40

$1.470

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Corohmni

South Africa . 361 parts In-Stock

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$1.540

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Microchip USA

USA . 478 parts In-Stock

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$16.900

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Kepictronics

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Problanco Electronics

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TANS Electronics

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Supply Digital

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SupplyDigital Components

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Corphita

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Glotronic Ltd.

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Kulean Microsystems

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UHIMA Technologies

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Cyclops Electronics Ltd (Excess)

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Montclair Electronics, Inc.

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Overview

Discover the power and precision of the MMBT5771 by Onsemi, a top-tier manufacturer known for delivering high-quality RF Small Signal Bipolar Junction Transistors. Perfect for switching applications, this PNP transistor offers unparalleled performance in a compact package. With a minimum DC current gain of 50 and a maximum operating temperature of 150 °C, this product is designed to exceed expectations. Trust Onsemi to provide reliable solutions for your electronics needs, ensuring optimal performance and longevity. Elevate your projects with the MMBT5771 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation properties and mechanical strength, making the transistor durable and reliable.

Polarity or Channel Type: PNP

Suitable for applications where PNP transistors are required, offering compatibility with existing circuit designs.

Configuration: SINGLE

Simplified design and ease of use for applications that only require a single transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in these scenarios.

Surface Mount: YES

Suitable for automated assembly processes and compact designs, enhancing overall system integration.

Package Shape: RECTANGULAR

Space-efficient shape that allows for easy placement on circuit boards.

Terminal Form: GULL WING

Facilitates easy soldering and connection to circuit boards, improving overall reliability.

Maximum Power Dissipation: 0.35 W

Suitable for low-power applications, ensuring efficient performance without overheating.

Minimum DC Current Gain (hFE): 50

Ensures consistent and stable amplification of current in the circuit.

Maximum Operating Temperature: 150 °C

Capable of operating in a wide temperature range, suitable for various environmental conditions.

Maximum Collector-Base Capacitance: 3 pF

Low capacitance minimizes the effect on high-frequency signal performance in the circuit.

Maximum Collector-Emitter Voltage: 15 V

Supports higher voltage applications without the risk of breakdown or failure.

Transistor Element Material: SILICON

High-quality material that ensures reliable and consistent transistor performance.

Maximum Collector Current (IC): 0.2 A

Sufficient current handling capacity for a range of low-power applications.

Terminal Finish: MATTE TIN

Provides a good soldering surface and protection against oxidation.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and connections.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow processes without damaging the transistor.

Peak Reflow Temperature °C: 260

High reflow temperature allows for reliable soldering and mechanical connections.

Nominal Transition Frequency (fT): 700 MHz

High transition frequency enables fast switching speed and performance in high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBT5771 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

3 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Minimum DC Current Gain (hFE):

50

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBT5771 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-546-0153, 5961015460153

NIIN

015460153

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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