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KSC2223O

Onsemi

KSC2223O by Onsemi

KSC2223O by Onsemi is an NPN BJT transistor with a max VCEsat of 0.3V, ideal for amplifier applications in the very high frequency band. It has a min hFE of 60, operates b/w -55 to 150 °C, and can handle a max IC of 0.02A in a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,129 parts In-Stock

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Digiode

USA . 426 parts In-Stock

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Kulean Microsystems

USA . 5,685 parts In-Stock

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Problanco Electronics

Mexico . 3,136 parts In-Stock

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Assy Fe

Spain . 2,900 parts In-Stock

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Corphita

USA . 2,299 parts In-Stock

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TANS Electronics

Latvia . 1,283 parts In-Stock

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Supply Digital

USA . 691 parts In-Stock

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UHIMA Technologies

Türkiye . 567 parts In-Stock

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SupplyDigital Components

Austria . 283 parts In-Stock

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Corohmni

South Africa . 148 parts In-Stock

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Overview

Elevate your electronic projects with the KSC2223O by Onsemi, a top-tier RF Small Signal Bipolar Junction Transistor that guarantees superior quality and performance. Manufactured by Onsemi, a trusted industry leader, this NPN transistor offers unrivaled reliability and efficiency for amplifier applications in the very high frequency band. With features like low VCEsat and high transition frequency, the KSC2223O ensures optimal functionality and seamless integration. Upgrade your designs today with this cutting-edge component and experience the unmatched value it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, increasing its durability and reliability.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product suitable for amplifier applications.

Configuration: SINGLE

The single configuration makes it easier to integrate this transistor into circuits, simplifying the design process.

Surface Mount: YES

Being surface mountable, this transistor can be easily mounted on circuit boards, saving space and simplifying manufacturing processes.

Maximum VCEsat: 0.3 V

The low VCEsat value indicates minimal voltage drop across the collector-emitter junction, resulting in efficient amplification.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

This transistor is capable of operating in very high frequency bands, making it suitable for high-speed applications such as communication systems.

Maximum Power Dissipation (Abs): 0.15 W

With a maximum power dissipation of 0.15 W, this transistor can handle moderate power levels, ensuring reliable operation.

Minimum DC Current Gain (hFE): 60

The high DC current gain indicates that small changes in input current can result in large changes in output current, making this transistor highly sensitive.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this transistor to be used in a wide range of environments without compromising performance.

Maximum Collector-Emitter Voltage: 20 V

The high collector-emitter voltage rating provides a wide voltage range for the transistor to operate within, increasing its versatility.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that this transistor can function in cold environments without losing performance.

Maximum Collector Current (IC): 0.02 A

With a maximum collector current of 0.02 A, this transistor can handle moderate current levels, making it suitable for low-power applications.

Nominal Transition Frequency (fT): 600 MHz

The high transition frequency allows this transistor to amplify signals accurately and efficiently at high frequencies, making it ideal for high-speed applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) KSC2223O attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

60

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.3 V

Trade Compliance

KSC2223O Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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