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MSC2295-BT1G

Onsemi

MSC2295-BT1G by Onsemi

MSC2295-BT1G by Onsemi is a NPN BJT transistor for RF applications. With hFE of 70, it operates at 150 °C max temperature and has fT of 150 MHz. Ideal for amplifier circuits due to its small outline package and low collector current of 0.03 A.

Median Price

$0.053

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.044

10k+ parts

$0.039

21,000

-

$0.053

$0.044

$0.039

DigiKey

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.070

21,000

-

-

-

$0.070

Verical

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.049

21,000

-

-

-

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,827 parts In-Stock

1+ parts

$0.041

100+ parts

-

1k+ parts

-

10k+ parts

-

1,827

$0.041

-

-

-

Vyrian

USA . 2,408 parts In-Stock

1+ parts

$0.043

100+ parts

-

1k+ parts

-

10k+ parts

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2,408

$0.043

-

-

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DigiKey Marketplace

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

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21,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,973 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

-

10k+ parts

-

1,973

$0.039

-

-

-

Component Stockers USA

USA . 22,935 parts In-Stock

1+ parts

$0.040

100+ parts

$0.040

1k+ parts

$0.040

10k+ parts

$0.040

22,935

$0.040

$0.040

$0.040

$0.040

Corohmni

South Africa . 369 parts In-Stock

1+ parts

$0.043

100+ parts

-

1k+ parts

-

10k+ parts

-

369

$0.043

-

-

-

Kepictronics

USA . 33,000 parts In-Stock

1+ parts

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33,000

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-

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Continental Prestige Electronics

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.038

10k+ parts

-

21,000

-

-

$0.038

-

Kulean Microsystems

USA . 6,871 parts In-Stock

1+ parts

-

100+ parts

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6,871

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-

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A-Z Elektronik GmbH

Germany . 6,438 parts In-Stock

1+ parts

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6,438

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SupplyDigital Components

Austria . 5,279 parts In-Stock

1+ parts

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5,279

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Problanco Electronics

Mexico . 2,601 parts In-Stock

1+ parts

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2,601

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TANS Electronics

Latvia . 1,151 parts In-Stock

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100+ parts

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1,151

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UHIMA Technologies

Türkiye . 430 parts In-Stock

1+ parts

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100+ parts

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430

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-

Overview

Discover the MSC2295-BT1G by Onsemi, a top-quality RF Small Signal BJT that delivers exceptional performance in amplifier applications. Manufactured by the reputable Onsemi brand, this NPN transistor offers reliable functionality and efficiency. With its compact package and high transition frequency of 150 MHz, this product is perfect for various electronics projects. Experience the value and benefits of the MSC2295-BT1G, designed to meet your needs with precision and excellence. Elevate your designs with this innovative solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

Allows for easy integration with NPN-based circuits and systems.

Configuration: SINGLE

Simplified design with a single configuration for easy implementation.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplification tasks.

Surface Mount: YES

Facilitates easy surface mounting onto PCBs, saving space and enabling automated assembly processes.

Package Shape: RECTANGULAR

Compact and standardized package shape for easy integration and compatibility with existing systems.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and connection to the circuit.

Maximum Power Dissipation (Abs): 0.2 W

Ability to handle up to 0.2W of power ensures reliability and stability in operation.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact electronic devices.

Minimum DC Current Gain (hFE): 70

High DC current gain of 70 ensures efficient signal amplification and performance.

Maximum Operating Temperature: 150 °C

Wide operating temperature range of up to 150 °C allows for use in various environments and applications.

Maximum Collector-Base Capacitance: 1.5 pF

Low collector-base capacitance ensures minimal signal distortion and interference.

Maximum Collector-Emitter Voltage: 20 V

High collector-emitter voltage rating of 20V provides robustness and protection against voltage spikes.

Transistor Element Material: SILICON

Silicon-based transistor element material offers high performance and reliability in operation.

Maximum Collector Current (IC): 0.03 A

Able to handle collector currents up to 0.03A for efficient signal amplification.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity for reliable electrical connections.

Terminal Position: DUAL

Dual terminal position allows flexibility in circuit design and connection configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal time at peak reflow temperature of 30 seconds ensures proper soldering and thermal management.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C enables reliable and consistent soldering during manufacturing processes.

Nominal Transition Frequency (fT): 150 MHz

High nominal transition frequency of 150MHz indicates fast switching speeds and high-frequency operation.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MSC2295-BT1G attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.5 pF

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

70

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MSC2295-BT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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