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MSC2295-BT1

Onsemi

MSC2295-BT1 by Onsemi

The Onsemi MSC2295-BT1 is an NPN RF BJT transistor with 3 terminals, ideal for amplifier applications. It has a max operating temp of 150 °C, fT of 150 MHz, and hFE of 70. The package is small outline with gull wing terminals, suitable for surface mount assembly.

Median Price

$0.053

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.044

10k+ parts

$0.039

36,000

-

$0.053

$0.044

$0.039

DigiKey

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.070

36,000

-

-

-

$0.070

Verical

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.049

36,000

-

-

-

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,569 parts In-Stock

1+ parts

$0.040

100+ parts

-

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-

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1,569

$0.040

-

-

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Digiode

USA . 1,052 parts In-Stock

1+ parts

$0.041

100+ parts

-

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-

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1,052

$0.041

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 201 parts In-Stock

1+ parts

$0.039

100+ parts

-

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201

$0.039

-

-

-

Corohmni

South Africa . 351 parts In-Stock

1+ parts

$0.040

100+ parts

-

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351

$0.040

-

-

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Continental Prestige Electronics

USA . 36,000 parts In-Stock

1+ parts

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100+ parts

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$0.040

10k+ parts

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36,000

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-

$0.040

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QUARKTWIN TECHNOLOGY LTD

USA . 10,599 parts In-Stock

1+ parts

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10,599

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Kepictronics

USA . 9,700 parts In-Stock

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9,700

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TANS Electronics

Latvia . 6,140 parts In-Stock

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6,140

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A-Z Elektronik GmbH

Germany . 4,821 parts In-Stock

1+ parts

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4,821

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Problanco Electronics

Mexico . 4,164 parts In-Stock

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4,164

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SupplyDigital Components

Austria . 4,137 parts In-Stock

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4,137

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Kulean Microsystems

USA . 2,402 parts In-Stock

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2,402

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Infinite Electronics LLP (Excess)

. 1,138 parts In-Stock

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1,138

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UHIMA Technologies

Türkiye . 340 parts In-Stock

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340

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Overview

Upgrade your electronic devices with the MSC2295-BT1 by Onsemi, a top-quality RF Small Signal Bipolar Junction Transistor. Manufactured by Onsemi, a leader in semiconductor solutions, this NPN transistor offers unparalleled performance and reliability. Ideal for amplifier applications, this transistor boasts a maximum operating temperature of 150 °C and a nominal transition frequency of 150 MHz. With a compact design and gull wing terminals for easy installation, the MSC2295-BT1 is the perfect choice for enhancing the functionality of your electronics. Experience superior quality and efficiency with Onsemi's innovative transistor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is typically durable and can protect the transistor from external environmental factors, making it a reliable choice for various applications.

Polarity or Channel Type: NPN

NPN type transistors are commonly used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Single configuration makes it easy to integrate into circuits and simplifies the design process.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplification circuits.

Surface Mount: YES

Surface mount capability allows for easy and efficient placement on circuit boards during assembly.

Package Shape: RECTANGULAR

Rectangular shape makes it compatible with standard packaging and mounting processes.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and efficient soldering during assembly.

No. of Terminals: 3

3 terminals allow for simple and straightforward connections in electronic circuits.

Maximum Power Dissipation (Abs): 0.2 W

With a maximum power dissipation of 0.2W, this transistor can handle moderate power levels in various applications.

Package Style (Meter): SMALL OUTLINE

Small outline packaging saves space on circuit boards and allows for compact designs.

Minimum DC Current Gain (hFE): 70

With a minimum current gain of 70, this transistor provides consistent and stable amplification.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150 °C, making it suitable for a wide range of operating conditions.

Maximum Collector-Base Capacitance: 1.5 pF

Low collector-base capacitance ensures minimal signal distortion in high frequency applications.

Maximum Collector-Emitter Voltage: 20 V

With a maximum collector-emitter voltage of 20V, this transistor can withstand moderate voltage levels.

Transistor Element Material: SILICON

Silicon material ensures reliable performance and stability in various operating conditions.

Maximum Collector Current (IC): 0.03 A

With a maximum collector current of 0.03A, this transistor can handle moderate current levels in amplification circuits.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting and connection options in electronic circuits.

Peak Reflow Temperature °C: 235

Peak reflow temperature of 235 °C ensures proper soldering and assembly during manufacturing processes.

Nominal Transition Frequency (fT): 150 MHz

With a nominal transition frequency of 150MHz, this transistor is suitable for high frequency applications such as RF amplification.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MSC2295-BT1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.5 pF

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

70

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MSC2295-BT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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