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MPSH17RLRM

Onsemi

MPSH17RLRM by Onsemi

MPSH17RLRM by Onsemi is an NPN RF BJT transistor with a max fT of 800 MHz. It operates in the VHF band, has a max Vce of 15V, and low Ccb of 0.9 pF. Ideal for amplifier applications due to its high frequency capabilities and through-hole terminal form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,054 parts In-Stock

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Vyrian

USA . 166 parts In-Stock

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Problanco Electronics

Mexico . 8,267 parts In-Stock

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Kulean Microsystems

USA . 8,076 parts In-Stock

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Corphita

USA . 2,133 parts In-Stock

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SupplyDigital Components

Austria . 419 parts In-Stock

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Corohmni

South Africa . 415 parts In-Stock

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UHIMA Technologies

Türkiye . 102 parts In-Stock

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TANS Electronics

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Overview

Unleash the power of cutting-edge technology with the MPSH17RLRM by Onsemi, a top-of-the-line RF Small Signal Bipolar Junction Transistor. Crafted with precision by the renowned manufacturer Onsemi, this NPN transistor offers unparalleled performance and reliability in amplifier applications. Whether you're looking to enhance your audio system or boost signal strength in communication devices, this transistor delivers exceptional quality and value. Elevate your projects to new heights with the MPSH17RLRM and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation properties and durability, making the transistor more reliable in various operating conditions.

Polarity or Channel Type: NPN

NPN transistors are commonly used for amplification purposes, making this transistor suitable for amplifier applications.

Configuration: SINGLE

Single configuration simplifies the design and integration of the transistor into circuits, making it easier to work with.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in amplification tasks.

Package Shape: ROUND

Round package shape allows for easy mounting and facilitates heat dissipation, enhancing the overall performance of the transistor.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a sturdy connection and ease of soldering, ensuring secure placement and reliable performance.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Capable of operating in very high frequency bands, making it suitable for applications requiring high-speed signal processing.

No. of Terminals: 3

With 3 terminals, it allows for versatile circuit configurations and connections, enhancing the flexibility of usage.

Package Style (Meter): CYLINDRICAL

Cylindrical package style offers compactness and compatibility with standard mounting methods, facilitating easy integration into circuits.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable performance in various environments and under different operating conditions.

Maximum Collector-Base Capacitance: 0.9 pF

Low collector-base capacitance minimizes signal distortion and interference, improving the overall signal integrity and quality.

Maximum Collector-Emitter Voltage: 15 V

With a high collector-emitter voltage rating, the transistor can handle higher voltages without breakdown, ensuring robustness and reliability.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability, making the transistor suitable for demanding applications where durability is crucial.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and corrosion resistance, ensuring long-term stability and reliability in connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on circuit boards, enhancing the stability and performance of the transistor.

Nominal Transition Frequency (fT): 800 MHz

High nominal transition frequency allows for fast switching speeds and high-frequency operation, making it suitable for applications requiring rapid signal processing.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH17RLRM attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.9 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH17RLRM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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