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MPS5179RLRAG

Onsemi

MPS5179RLRAG by Onsemi

MPS5179RLRAG by Onsemi is a NPN RF BJT with 3 terminals, suitable for amplifier applications in the VHF band. It has a max power dissipation of 0.2W, hFE of 25, and fT of 900MHz. The transistor operates at up to 150 °C, with VCE(max) of 12V and IC(max) of 0.05A.

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Vyrian

USA . 8,600 parts In-Stock

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Digiode

USA . 1,934 parts In-Stock

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AZTECH Wire

Italy . 138 parts In-Stock

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$10.390

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Component Stockers USA

USA . 680 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 17,324 parts In-Stock

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Problanco Electronics

Mexico . 8,075 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,464 parts In-Stock

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Kulean Microsystems

USA . 6,301 parts In-Stock

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TANS Electronics

Latvia . 3,223 parts In-Stock

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SupplyDigital Components

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Corphita

USA . 1,136 parts In-Stock

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UHIMA Technologies

Türkiye . 622 parts In-Stock

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South Africa . 357 parts In-Stock

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Overview

Enhance your amplifier designs with the MPS5179RLRAG by Onsemi, a premium quality RF Small Signal Bipolar Junction Transistor. Manufactured by Onsemi, known for their cutting-edge technology and reliability, this NPN transistor offers exceptional performance in very high-frequency applications. With a single configuration and through-hole terminals, this transistor provides a maximum power dissipation of 0.2 W and a nominal transition frequency of 900 MHz. Elevate your amplifier projects with the superior value, benefits, and advantages that Onsemi's MPS5179RLRAG brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the transistor and ensures durability.

Polarity or Channel Type: NPN

Commonly used type of transistor offering high efficiency and high current gain.

Configuration: SINGLE

Simplified design for ease of use and installation.

Transistor Application: AMPLIFIER

Suitable for amplification applications, providing reliable performance.

Package Shape: ROUND

Compact shape for easy integration into circuits.

Terminal Form: THROUGH-HOLE

Convenient form for soldering onto circuit boards.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Ideal for high-frequency applications requiring fast signal processing.

Maximum Power Dissipation (Abs): 0.2 W

Can handle moderate power levels without overheating.

Package Style (Meter): CYLINDRICAL

Space-efficient design for compact circuits.

Minimum DC Current Gain (hFE): 25

Ensures stable amplification with sufficient current gain.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments without performance degradation.

Maximum Collector-Base Capacitance: 1 pF

Low capacitance helps in high-frequency applications.

Maximum Collector-Emitter Voltage: 12 V

Suitable for low-voltage applications.

Transistor Element Material: SILICON

Common and reliable material choice for transistors.

Maximum Collector Current (IC): 0.05 A

Sufficient current handling capability for many applications.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and solderability.

Terminal Position: BOTTOM

Convenient terminal placement for circuit assembly.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes.

Nominal Transition Frequency (fT): 900 MHz

High transition frequency for fast signal switching.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPS5179RLRAG attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1 pF

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

25

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPS5179RLRAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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