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BF959RL

Onsemi

BF959RL by Onsemi

BF959RL by Onsemi is a NPN RF BJT with max. VCE of 20V and IC of 0.1A. Operating at 150 °C, it has fT of 700MHz making it ideal for very high frequency applications in electronics. The transistor's through-hole package and cylindrical shape enhance its performance in RF circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,346 parts In-Stock

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Digiode

USA . 819 parts In-Stock

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TANS Electronics

Latvia . 5,749 parts In-Stock

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SupplyDigital Components

Austria . 3,057 parts In-Stock

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Problanco Electronics

Mexico . 2,981 parts In-Stock

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Northwest PG Solutions

USA . 936 parts In-Stock

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Kulean Microsystems

USA . 846 parts In-Stock

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Native Components

USA . 291 parts In-Stock

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UHIMA Technologies

Türkiye . 178 parts In-Stock

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Corohmni

South Africa . 105 parts In-Stock

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Corphita

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Overview

Upgrade your RF Small Signal Bipolar Junction Transistor game with the top-quality BF959RL by Onsemi. Manufactured by industry leader Onsemi, this NPN transistor offers unparalleled performance in the very high-frequency band. Ideal for a wide range of applications, this transistor delivers exceptional value and benefits to customers looking for reliable and efficient solutions. Trust Onsemi's expertise and experience to take your projects to the next level with the BF959RL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and lightweight packaging for the transistor, ideal for various applications.

Polarity or Channel Type: NPN

NPN transistors typically have higher electron mobility and faster switching speeds compared to PNP transistors.

Configuration: SINGLE

Simplifies circuit design and makes it easier to integrate into electronic circuits.

Package Shape: ROUND

Allows for easy mounting and soldering onto circuit boards.

Terminal Form: THROUGH-HOLE

Enables secure and reliable connections to the circuit board.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Suitable for high-frequency applications such as radio frequency (RF) circuits.

No. of Terminals: 3

Provides necessary connections for the transistor to function within a circuit.

Package Style (Meter): CYLINDRICAL

Compact design for space-efficient circuit layouts.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures without performance degradation.

Maximum Collector-Emitter Voltage: 20 V

Allows for a wide range of voltage applications without risking damage to the transistor.

Transistor Element Material: SILICON

Silicon transistors offer good temperature stability and low noise characteristics.

Maximum Collector Current (IC): 0.1 A

Capable of handling moderate current levels for various electronic applications.

Terminal Finish: TIN LEAD

Provides corrosion resistance and ensures reliable solder connections.

Terminal Position: BOTTOM

Facilitates easy installation and maintenance within the circuit.

Nominal Transition Frequency (fT): 700 MHz

Indicates the frequency at which the transistor can effectively amplify signals.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BF959RL attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BF959RL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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