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2SC5227A-4-TB-E

Onsemi

2SC5227A-4-TB-E by Onsemi

Onsemi's 2SC5227A-4-TB-E is an NPN RF BJT with a max power dissipation of 0.2W and fT of 7000MHz. Ideal for small outline packages, it operates up to 150 °C, with IC at 0.07A making it suitable for high-frequency applications like RF amplifiers.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 8,494 parts In-Stock

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Digiode

USA . 1,643 parts In-Stock

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Vyrian

USA . 1,070 parts In-Stock

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Native Components

USA . 354 parts In-Stock

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$189.583

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$181.999

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$181.999

Northwest PG Solutions

USA . 2,221 parts In-Stock

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$208.541

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Metaverse IC Inc.

Canada . 9,000 parts In-Stock

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Kulean Microsystems

USA . 8,364 parts In-Stock

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Problanco Electronics

Mexico . 8,234 parts In-Stock

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SupplyDigital Components

Austria . 6,933 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,860 parts In-Stock

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TANS Electronics

Latvia . 5,473 parts In-Stock

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RC Electronics

USA . 5,400 parts In-Stock

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$0.320

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Kepictronics

USA . 4,000 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Corohmni

South Africa . 294 parts In-Stock

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UHIMA Technologies

Türkiye . 234 parts In-Stock

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Overview

Unleash the power of innovation with the Onsemi 2SC5227A-4-TB-E RF Small Signal Bipolar Junction Transistor. Manufactured by industry leader Onsemi, this NPN transistor offers unparalleled quality and reliability for a wide range of applications. With a minimum DC current gain of 90 and a maximum operating temperature of 150 °C, this transistor is designed to deliver superior performance in even the most demanding environments. Whether you're designing wireless communication systems or high-frequency amplifiers, the 2SC5227A-4-TB-E provides the value, benefits, and advantages that customers need to stay ahead of the competition.

Feature Benefit Bullets

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product suitable for a wide range of applications.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces complexity, making the product easier to use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Maximum Power Dissipation (Abs): 0.2 W

With a relatively high maximum power dissipation, this transistor can handle moderate power levels without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space, making it suitable for compact designs.

Minimum DC Current Gain (hFE): 90

A high minimum DC current gain ensures stable and consistent amplification in the circuit.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without performance degradation.

Maximum Collector-Emitter Voltage: 10 V

The high maximum collector-emitter voltage rating provides flexibility in circuit design and operation.

Maximum Collector Current (IC): 0.07 A

Capable of handling moderate collector current, making it suitable for various applications.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish offers good solderability and reliability in assembly processes.

Nominal Transition Frequency (fT): 7000 MHz

High nominal transition frequency allows for high-frequency operation, making this product ideal for RF applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) 2SC5227A-4-TB-E attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

10 V

Configuration:

Minimum DC Current Gain (hFE):

90

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Transition Frequency (fT):

Trade Compliance

2SC5227A-4-TB-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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