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2SC5646A-TL-H

Onsemi

2SC5646A-TL-H by Onsemi

Onsemi's 2SC5646A-TL-H is an NPN RF BJT with max power dissipation of 0.1W, hFE of 100, and fT of 8000MHz. Ideal for applications requiring high-frequency signal amplification in a surface-mount configuration.

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Lifecycle Status

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1k+

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Digiode

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Native Components

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Northwest PG Solutions

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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Overview

Discover the unparalleled performance of the Onsemi 2SC5646A-TL-H RF Small Signal Bipolar Junction Transistor. Manufactured by industry leader Onsemi, this NPN transistor offers exceptional quality and reliability for a wide range of applications. With a minimum DC current gain of 100 and a nominal transition frequency of 8000 MHz, this transistor delivers superior performance in a compact surface-mount configuration. Trust Onsemi to provide cutting-edge technology that exceeds your expectations. Elevate your projects with the Onsemi 2SC5646A-TL-H - experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product versatile and compatible with many applications.

Configuration: SINGLE

Single configuration simplifies circuit design and layout, making it easier to integrate into electronic devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and effort during production.

Maximum Power Dissipation (Abs): 0.1 W

With a maximum power dissipation of 0.1 W, this transistor can handle moderate power levels without overheating, ensuring reliable performance.

Minimum DC Current Gain (hFE): 100

A minimum DC current gain of 100 indicates a high level of amplification, making this transistor suitable for signal amplification applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand higher temperatures, increasing its durability and reliability in harsh environments.

Maximum Collector Current (IC): 0.03 A

The maximum collector current of 0.03 A allows for sufficient current handling capacity, making it suitable for low to medium current applications.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good solderability and reliability, ensuring secure connections and long-term performance.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature of 30 seconds helps prevent damage to the transistor during the soldering process, maintaining its electrical properties.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for reliable soldering and ensures proper bonding with the PCB, enhancing overall product quality.

Nominal Transition Frequency (fT): 8000 MHz

High nominal transition frequency of 8000 MHz indicates fast switching speeds, making this transistor ideal for high-frequency applications such as RF amplification.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) 2SC5646A-TL-H attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Configuration:

Minimum DC Current Gain (hFE):

100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Transition Frequency (fT):

Trade Compliance

2SC5646A-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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