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BF959RLRE

Onsemi

BF959RLRE by Onsemi

BF959RLRE by Onsemi is a NPN RF BJT with max. 20V VCE, 0.1A IC, and 700MHz fT. Ideal for very high frequency band applications due to its silicon element material and cylindrical package style. Operating temp up to 150 °C makes it suitable for various through-hole configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,450 parts In-Stock

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Digiode

USA . 92 parts In-Stock

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92

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Native Components

USA . 601 parts In-Stock

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$2.059

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601

$2.059

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Northwest PG Solutions

USA . 1,007 parts In-Stock

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$2.265

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SupplyDigital Components

Austria . 6,194 parts In-Stock

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TANS Electronics

Latvia . 6,060 parts In-Stock

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Kulean Microsystems

USA . 3,232 parts In-Stock

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Corphita

USA . 1,790 parts In-Stock

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Problanco Electronics

Mexico . 1,605 parts In-Stock

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Corohmni

South Africa . 247 parts In-Stock

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UHIMA Technologies

Türkiye . 237 parts In-Stock

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Overview

Experience the superior performance of the BF959RLRE by Onsemi, a top-of-the-line RF Small Signal Bipolar Junction Transistor. Crafted with precision and expertise by Onsemi, this NPN transistor offers unparalleled reliability and efficiency in a variety of applications. With a very high frequency band and a maximum collector-emitter voltage of 20V, this transistor is ideal for high-performance electronic devices. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations. Elevate your projects with the BF959RLRE and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits, making this product versatile for different electronic designs.

Configuration: SINGLE

Simplified design with a single transistor configuration for easier integration into circuits.

Package Shape: ROUND

Round package shape allows for easy mounting and integration into circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering onto PCBs.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Ideal for applications that require operation in very high frequency bands, offering excellent performance in such scenarios.

No. of Terminals: 3

Simple 3-terminal setup for easy connectivity in circuits.

Package Style: CYLINDRICAL

Cylindrical package style offers efficient use of space on PCBs.

Maximum Operating Temperature: 150 °C

Can operate at relatively high temperatures without performance degradation, suitable for different environmental conditions.

Maximum Collector-Emitter Voltage: 20 V

Offers a high maximum voltage rating for collector-emitter applications.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability in transistor operations.

Maximum Collector Current (IC): 0.1 A

Can handle collector currents up to 0.1 A, suitable for various low-power applications.

Terminal Finish: TIN LEAD

Tin lead finish on terminals for excellent solderability and electrical conductivity.

Terminal Position: BOTTOM

Bottom terminal position for easy mounting on PCBs and connections.

Nominal Transition Frequency (fT): 700 MHz

Nominal transition frequency of 700 MHz indicates high-speed switching capabilities, suitable for fast signal processing applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BF959RLRE attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BF959RLRE Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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