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BFR181-E6327

Infineon Technologies

BFR181-E6327 by Infineon Technologies

BFR181-E6327 by Infineon Technologies is a NPN RF BJT with 3 terminals, suitable for L Band applications. It has a max fT of 8000 MHz, hFE of 50, and VCE(max) of 12V. Ideal for amplifier circuits due to its small outline package and high transition frequency.

Median Price

$0.197

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 37,182 parts In-Stock

1+ parts

$0.084

100+ parts

$0.079

1k+ parts

$0.071

10k+ parts

-

37,182

$0.084

$0.079

$0.071

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Mouser Electronics

USA . 428 parts In-Stock

1+ parts

$1.140

100+ parts

$0.499

1k+ parts

$0.233

10k+ parts

$0.159

428

$1.140

$0.499

$0.233

$0.159

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.197

10k+ parts

$0.186

6,000

-

-

$0.197

$0.186

Distributors (In-Stock)

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Digiode

USA . 562 parts In-Stock

1+ parts

$0.080

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-

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562

$0.080

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Vyrian

USA . 102 parts In-Stock

1+ parts

$0.084

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102

$0.084

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DF Sales Co.

USA . 3,000 parts In-Stock

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$0.200

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3,000

$0.200

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DF Sales Co.

USA . 3,000 parts In-Stock

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$0.200

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-

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3,000

$0.200

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Bristol Electronics

USA . 3,255 parts In-Stock

1+ parts

$0.375

100+ parts

$0.188

1k+ parts

$0.075

10k+ parts

$0.056

3,255

$0.375

$0.188

$0.075

$0.056

Chip Stock

USA . 12,404 parts In-Stock

1+ parts

-

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12,404

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North Shore Components

USA . 12,000 parts In-Stock

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12,000

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Rutronik

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

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$0.097

6,000

-

-

-

$0.097

ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

1+ parts

-

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3,000

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Dan-Mar Components

USA . 3,000 parts In-Stock

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3,000

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Prism Electronics

USA . 1,286 parts In-Stock

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1,286

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Q Components

USA . 550 parts In-Stock

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550

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LIBRA Elektronik GmbH

Germany . 298 parts In-Stock

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298

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 745 parts In-Stock

1+ parts

$0.076

100+ parts

-

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745

$0.076

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CoreStaff

Japan . 6,000 parts In-Stock

1+ parts

$0.264

100+ parts

$0.149

1k+ parts

$0.098

10k+ parts

-

6,000

$0.264

$0.149

$0.098

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Modulus Dynamics

Lithuania . 3,652 parts In-Stock

1+ parts

$0.429

100+ parts

$0.412

1k+ parts

$0.395

10k+ parts

-

3,652

$0.429

$0.412

$0.395

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Andel Nordic

Denmark . 568 parts In-Stock

1+ parts

$51.820

100+ parts

-

1k+ parts

$36.277

10k+ parts

$36.277

568

$51.820

-

$36.277

$36.277

Assy Fe

Spain . 24,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 19,205 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,763 parts In-Stock

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Lixinc

USA . 4,325 parts In-Stock

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GreenTree Electronics

Israel . 4,300 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Perfect Parts

USA . 1,440 parts In-Stock

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1,440

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Northwest PG Solutions

USA . 699 parts In-Stock

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699

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Native Components

USA . 177 parts In-Stock

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177

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Overview

Upgrade your RF applications with the BFR181-E6327 by Infineon Technologies. This high-quality NPN transistor offers unmatched performance and reliability in amplifier circuits, making it the ideal choice for L Band frequency applications. With a small outline package and gull wing terminals, this transistor is easy to install and provides a maximum collector-emitter voltage of 12V. Trust Infineon Technologies to deliver cutting-edge solutions that exceed your expectations. Elevate your designs with the BFR181-E6327 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and high resistance to heat, making it suitable for various environments and applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification circuits due to their ability to amplify signals with higher efficiency.

Configuration: SINGLE

Single configuration simplifies the circuit design and makes it easier to integrate into different electronic systems.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring high performance and reliability in signal amplification.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and enabling mass production.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures up to 150°C, ideal for applications where temperature fluctuations are common.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) BFR181-E6327 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Additional Features:

LOW NOISE

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.45 pF

Maximum Collector-Emitter Voltage:

12 V

Configuration:

Minimum DC Current Gain (hFE):

50

Highest Frequency Band:

L BAND

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BFR181-E6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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