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TIS126

Texas Instruments

TIS126 by Texas Instruments

TIS126 by Texas Instruments is an NPN BJT transistor with a max collector-emitter voltage of 40V and a transition frequency of 600MHz. It is commonly used as an amplifier in the very high-frequency band applications due to its 0.4W power dissipation capability and SILICON element material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,815 parts In-Stock

1+ parts

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3,815

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Digiode

USA . 3,405 parts In-Stock

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3,405

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MISTER SPROCKETS

USA . 43 parts In-Stock

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43

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,014 parts In-Stock

1+ parts

$0.965

100+ parts

-

1k+ parts

$1.864

10k+ parts

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2,014

$0.965

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$1.864

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DigiPath Technology Company

USA . 256 parts In-Stock

1+ parts

$1.062

100+ parts

$0.977

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-

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256

$1.062

$0.977

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ChromeModa Solutions

Germany . 5,399 parts In-Stock

1+ parts

$1.084

100+ parts

$0.889

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-

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5,399

$1.084

$0.889

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IDEA Electronic Components Group

UK . 1,910 parts In-Stock

1+ parts

$1.084

100+ parts

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$0.976

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1,910

$1.084

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$0.976

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One Stop Electronics

USA . 518 parts In-Stock

1+ parts

$11.050

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518

$11.050

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AZTECH Wire

Italy . 896 parts In-Stock

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$13.834

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896

$13.834

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Corphita

USA . 4,872 parts In-Stock

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4,872

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TIS126 RF Small Signal Bipolar Junction Transistor. Ideal for amplifier applications in the very high-frequency band, this NPN transistor offers exceptional performance and efficiency. With a maximum collector-emitter voltage of 40V and a nominal transition frequency of 600MHz, the TIS126 delivers superior results. Trust Texas Instruments to provide you with cutting-edge technology that exceeds your expectations. Elevate your projects with the TIS126 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

Commonly used configuration for amplification circuits, offering reliable performance.

Configuration: SINGLE

Simplified design for easy integration into circuits.

Transistor Application: AMPLIFIER

Specifically designed for amplification tasks, ensuring optimal performance.

Package Shape: ROUND

Compact form factor for space-saving design implementations.

Terminal Form: WIRE

Allows for easy connection and soldering in circuits.

Highest Frequency Band: VERY HIGH FREQUENCY BAND

Ideal for applications that require high-speed signal processing.

Maximum Power Dissipation (Abs): 0.4 W

Efficient power handling capability for reliable operation.

Package Style (Meter): CYLINDRICAL

Easy to mount and install in cylindrical enclosures or PCB layouts.

Minimum DC Current Gain (hFE): 25

Provides consistent gain for stable amplification performance.

Maximum Operating Temperature: 150 °C

Can withstand high temperature environments for extended use.

Maximum Collector-Base Capacitance: 0.36 pF

Low capacitance for improved high-frequency performance.

Maximum Collector-Emitter Voltage: 40 V

Safe operating voltage level for various applications.

Transistor Element Material: SILICON

Reliable semiconductor material known for its performance and durability.

Maximum Collector Current (IC): 0.05 A

Sufficient current handling capacity for typical amplifier circuits.

Terminal Position: BOTTOM

Convenient terminal layout for easy connection in circuit layouts.

Nominal Transition Frequency (fT): 600 MHz

High transition frequency for efficient signal processing in high-frequency applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) TIS126 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Texas Instruments

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

.36 pF

Maximum Collector-Emitter Voltage:

40 V

Configuration:

Minimum DC Current Gain (hFE):

25

Highest Frequency Band:

VERY HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-18

JESD-30 Code:

O-PBCY-W3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

TIS126 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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