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MPSH81RL

Onsemi

MPSH81RL by Onsemi

MPSH81RL by Onsemi is a PNP RF BJT transistor with 3 terminals. It has a max collector-emitter voltage of 20V, fT of 600MHz, and operates up to 150 °C. Ideal for amplifier applications due to its high transition frequency and low collector-base capacitance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,062 parts In-Stock

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Vyrian

USA . 2,021 parts In-Stock

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Problanco Electronics

Mexico . 7,770 parts In-Stock

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Kulean Microsystems

USA . 6,731 parts In-Stock

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SupplyDigital Components

Austria . 2,849 parts In-Stock

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TANS Electronics

Latvia . 2,807 parts In-Stock

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Corphita

USA . 1,357 parts In-Stock

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UHIMA Technologies

Türkiye . 916 parts In-Stock

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Corohmni

South Africa . 386 parts In-Stock

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Overview

Experience superior performance and reliability with the Onsemi MPSH81RL RF Small Signal Bipolar Junction Transistor. Manufactured by trusted industry leader Onsemi, this PNP transistor offers unparalleled quality and precision for a wide range of amplifier applications. With its durable plastic/epoxy construction and high operating temperature of 150 °C, the MPSH81RL ensures long-lasting performance in any environment. Upgrade your electronic designs with the value and benefits of this top-of-the-line transistor from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it suitable for various electronic applications.

Polarity or Channel Type: PNP

The PNP configuration allows for easy integration into circuit designs and compatibility with other components.

Configuration: SINGLE

The single configuration simplifies the design and ensures straightforward operation of the transistor in circuits.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal amplification tasks.

Package Shape: ROUND

The round package shape provides easy mounting and installation, making it convenient for use in various electronic devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy soldering and secure connection in circuit boards, enhancing reliability.

No. of Terminals: 3

Having three terminals simplifies the connection process and ensures proper functionality in electronic circuits.

Package Style (Meter): CYLINDRICAL

The cylindrical package style offers compactness and efficient space utilization in electronic designs.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the transistor can withstand heat and operate reliably in various environments.

Maximum Collector-Base Capacitance: 0.85 pF

The low collector-base capacitance reduces signal distortion and ensures high-frequency performance in amplification tasks.

Maximum Collector-Emitter Voltage: 20 V

The high collector-emitter voltage rating allows for safe operation and reliable performance in voltage amplification applications.

Transistor Element Material: SILICON

The silicon material of the transistor element provides high efficiency and reliability in signal amplification tasks.

Terminal Finish: TIN LEAD

The tin lead terminal finish facilitates soldering and ensures secure connections in electronic circuits.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and ensures easy integration of the transistor into circuit designs.

Nominal Transition Frequency (fT): 600 MHz

With a high nominal transition frequency, the transistor offers excellent frequency response and performance in amplifier applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MPSH81RL attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.85 pF

Maximum Collector-Emitter Voltage:

20 V

Configuration:

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSH81RL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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