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MMBTH69LT1

Onsemi

MMBTH69LT1 by Onsemi

MMBTH69LT1 by Onsemi is a PNP RF BJT transistor with 3 terminals, suitable for amplifier applications in the UHF band. It has a max collector-emitter voltage of 15V and fT of 2000MHz. This surface-mount transistor features a plastic/epoxy body, gull wing terminals, and low collector-base capacitance at 0.35pF.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

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PC Components Company LLC

USA . 1,218 parts In-Stock

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Bristol Electronics

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Digiode

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Kulean Microsystems

USA . 8,333 parts In-Stock

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TANS Electronics

Latvia . 6,021 parts In-Stock

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Problanco Electronics

Mexico . 5,802 parts In-Stock

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SupplyDigital Components

Austria . 4,861 parts In-Stock

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Corphita

USA . 888 parts In-Stock

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UHIMA Technologies

Türkiye . 817 parts In-Stock

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Corohmni

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Overview

Unlock the power of cutting-edge technology with the MMBTH69LT1 RF Small Signal Bipolar Junction Transistor by Onsemi. Crafted with precision and expertise, this PNP transistor is a game-changer in the world of amplification. Ideal for use in ultra-high frequency bands, this single configuration transistor offers unmatched performance and reliability. Whether you're looking to boost signal strength or enhance audio quality, the MMBTH69LT1 delivers exceptional value and benefits that will exceed your expectations. Experience the difference with Onsemi's top-of-the-line transistor today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: PNP

The PNP configuration allows for easy integration into existing circuit designs that require PNP transistors.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring reliable and efficient performance for amplification tasks.

Surface Mount: YES

The surface mount capability makes it easy to mount and solder the transistor onto circuit boards, saving space and simplifying assembly.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Ideal for applications that require high frequency operation, ensuring signal integrity and stability in demanding environments.

Maximum Collector-Emitter Voltage: 15 V

With a high maximum collector-emitter voltage, this transistor can handle higher voltage levels, making it versatile for various circuit designs.

Nominal Transition Frequency (fT): 2000 MHz

The high nominal transition frequency indicates fast switching speeds and high-frequency operation, making this transistor ideal for high-performance applications.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBTH69LT1 attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector-Base Capacitance:

.35 pF

Maximum Collector-Emitter Voltage:

15 V

Configuration:

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MMBTH69LT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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