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KSC1674-C

Onsemi

KSC1674-C by Onsemi

The Onsemi KSC1674-C is an NPN RF BJT transistor with a max VCEsat of 0.3V and fT of 600MHz. Ideal for amplifier applications, it has a max IC of 0.02A and operates up to 150 °C. Packaged in plastic/epoxy, it features a cylindrical shape with through-hole terminals.

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Lifecycle Status

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1k+

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Digiode

USA . 2,806 parts In-Stock

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Vyrian

USA . 1,869 parts In-Stock

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TANS Electronics

Latvia . 7,722 parts In-Stock

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SupplyDigital Components

Austria . 6,744 parts In-Stock

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Kulean Microsystems

USA . 3,346 parts In-Stock

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Supply Digital

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Problanco Electronics

Mexico . 2,391 parts In-Stock

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Corphita

USA . 741 parts In-Stock

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UHIMA Technologies

Türkiye . 715 parts In-Stock

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Corohmni

South Africa . 433 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the KSC1674-C by Onsemi, a leading manufacturer in the field of RF small signal Bipolar Junction Transistors. Designed for ultra-high frequency band applications, this NPN transistor offers a seamless amplification experience with a low VCEsat of 0.3V and a minimum DC current gain (hFE) of 40. Its compact package shape and through-hole terminal form make installation a breeze. Elevate your projects with the unmatched quality and value that Onsemi products provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifier circuits, making this product suitable for amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and makes it easier to integrate into existing systems.

Maximum VCEsat: 0.3 V

The low VCEsat value minimizes power loss and improves efficiency in amplifier circuits.

Package Shape: ROUND

The round package shape allows for easy mounting and ensures mechanical stability.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and provides a secure connection.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra high frequency applications, this transistor is ideal for high-performance RF amplifiers.

No. of Terminals: 3

The 3-terminal design provides flexibility in circuit connections and allows for various configurations.

Maximum Power Dissipation (Abs): 0.25 W

With a maximum power dissipation of 0.25W, this transistor can handle moderate power levels in amplifier circuits.

Package Style (Meter): CYLINDRICAL

The cylindrical package style simplifies mounting and ensures a compact design for space-constrained applications.

Maximum Power Dissipation Ambient: 0.25 W

The maximum ambient power dissipation rating of 0.25W allows for reliable operation in various environmental conditions.

Minimum DC Current Gain (hFE): 40

The minimum DC current gain of 40 ensures stable amplification and consistent performance in amplifier circuits.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperature environments without performance degradation.

Maximum Collector-Base Capacitance: 1.2 pF

The low collector-base capacitance minimizes signal distortion and ensures high frequency performance in RF amplifier applications.

Maximum Collector-Emitter Voltage: 20 V

The high collector-emitter voltage rating of 20V provides a safe operating margin for various amplifier circuit configurations.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this product a dependable choice for amplifier applications.

Maximum Collector Current (IC): 0.02 A

The maximum collector current rating of 0.02A allows for handling of moderate current levels in amplifier circuits.

Terminal Position: BOTTOM

The bottom terminal position simplifies circuit layout and facilitates easier connections in amplifier circuits.

Nominal Transition Frequency (fT): 600 MHz

With a nominal transition frequency of 600MHz, this transistor offers high-speed performance in RF amplifier circuits.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) KSC1674-C attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

1.2 pF

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

40

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Maximum Power Dissipation Ambient:

.25 W

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.3 V

Trade Compliance

KSC1674-C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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