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KAI-1020-ABB-JP-BA

Onsemi

KAI-1020-ABB-JP-BA by Onsemi

KAI-1020-ABB-JP-BA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1000 horizontal and vertical pixels, and a dynamic range of 60 dB. It operates b/w -50 to 70 °C, has a max supply voltage of 15.5 V, and data rate of 40 Mbps. Ideal for applications requiring high-quality imaging in various environmental conditions.

Median Price

$771.862

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$686.100

100+ parts

$644.930

1k+ parts

$603.770

10k+ parts

-

1

$686.100

$644.930

$603.770

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Verical

USA . 1 parts In-Stock

1+ parts

$857.625

100+ parts

-

1k+ parts

-

10k+ parts

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1

$857.625

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,339 parts In-Stock

1+ parts

$644.024

100+ parts

-

1k+ parts

-

10k+ parts

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1,339

$644.024

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-

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Vyrian

USA . 4,252 parts In-Stock

1+ parts

-

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4,252

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$11.080

100+ parts

-

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784

$11.080

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Corphita

USA . 340 parts In-Stock

1+ parts

$610.128

100+ parts

-

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340

$610.128

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Corohmni

South Africa . 382 parts In-Stock

1+ parts

$677.920

100+ parts

-

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382

$677.920

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Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$677.920

100+ parts

-

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1

$677.920

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SupplyDigital Components

Austria . 8,187 parts In-Stock

1+ parts

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8,187

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Kulean Microsystems

USA . 7,856 parts In-Stock

1+ parts

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7,856

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Problanco Electronics

Mexico . 2,807 parts In-Stock

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2,807

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TANS Electronics

Latvia . 1,772 parts In-Stock

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1,772

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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UHIMA Technologies

Türkiye . 822 parts In-Stock

1+ parts

-

100+ parts

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822

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Overview

Unleash the power of cutting-edge imaging technology with the KAI-1020-ABB-JP-BA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and innovation in image sensors. Ideal for a wide range of applications, this sensor offers customers exceptional value and benefits. Experience crystal-clear images and superior performance like never before with the KAI-1020-ABB-JP-BA. Elevate your projects to new heights with this advanced sensor technology.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Small pixel size allows for high resolution images to be captured with great detail.

Maximum Supply Voltage: 15.5 V

Ability to handle higher voltage allows for flexibility in power supply options.

Body Width: 27.94 inch

Compact size makes it easy to integrate into various devices or systems.

Power Supplies (V): 15

Optimal power supply voltage to ensure efficient performance.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensor technology offers high-quality image capture for excellent results.

Package Shape or Style: SQUARE

Square package shape allows for easy mounting and alignment during installation.

Minimum Supply Voltage: 14.5 V

With a low minimum supply voltage, the sensor can operate efficiently even under low power conditions.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliability in varying environmental conditions.

Horizontal Pixel: 1000

High horizontal pixel count enables capturing wide-angle images with clarity.

Minimum Operating Temperature: -50 °C

Can operate in extremely low temperatures, suitable for a wide range of applications.

Dynamic Range: 60 dB

Good dynamic range allows for capturing both bright and dark areas in a scene accurately.

Vertical Pixel: 1000

High vertical pixel count ensures detailed image capture in the vertical plane.

Body Length/Diameter: 27.94 mm

Compact body size makes it easy to fit into small devices or systems.

Data Rate: 40 Mbps

High data rate allows for quick transfer of image data for real-time applications.

Termination Type: SOLDER

Solder-type termination provides a secure connection for reliable performance.

Array Type: INTERLINE

Interline array type allows for efficient reading of image data for faster processing.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies installation and integration into electronic systems.

Technical Specifications

Image Sensors KAI-1020-ABB-JP-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 12 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

27.94 inch

Body Length/Diameter:

27.94 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

1000

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1000

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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