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KAI-0340-FBA-CB-AA-DUAL

Onsemi

KAI-0340-FBA-CB-AA-DUAL by Onsemi

KAI-0340-FBA-CB-AA-DUAL by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.

Median Price

$185.028

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 134 parts In-Stock

1+ parts

$155.500

100+ parts

$146.170

1k+ parts

$136.840

10k+ parts

-

134

$155.500

$146.170

$136.840

-

Arrow

USA . 64 parts In-Stock

1+ parts

$376.750

100+ parts

$310.260

1k+ parts

-

10k+ parts

-

64

$376.750

$310.260

-

-

DigiKey

USA . 134 parts In-Stock

1+ parts

-

100+ parts

$187.780

1k+ parts

$187.780

10k+ parts

$187.780

134

-

$187.780

$187.780

$187.780

Verical

USA . 131 parts In-Stock

1+ parts

-

100+ parts

$182.275

1k+ parts

$170.637

10k+ parts

-

131

-

$182.275

$170.637

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,252 parts In-Stock

1+ parts

$171.532

100+ parts

-

1k+ parts

-

10k+ parts

-

2,252

$171.532

-

-

-

Vyrian

USA . 6,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,271

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 134 parts In-Stock

1+ parts

$153.280

100+ parts

-

1k+ parts

-

10k+ parts

-

134

$153.280

-

-

-

Corphita

USA . 2,157 parts In-Stock

1+ parts

$162.504

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

$162.504

-

-

-

Corohmni

South Africa . 263 parts In-Stock

1+ parts

$180.560

100+ parts

-

1k+ parts

-

10k+ parts

-

263

$180.560

-

-

-

Problanco Electronics

Mexico . 7,586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,586

-

-

-

-

TANS Electronics

Latvia . 3,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,834

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

SupplyDigital Components

Austria . 999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

999

-

-

-

-

UHIMA Technologies

Türkiye . 571 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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571

-

-

-

-

Kulean Microsystems

USA . 495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

495

-

-

-

-

Overview

Unleash the power of cutting-edge imaging technology with the KAI-0340-FBA-CB-AA-DUAL by Onsemi. As a leader in image sensor manufacturing, Onsemi delivers top-quality products that push the boundaries of performance and reliability. This dual-channel image sensor is perfect for applications requiring high-resolution images with exceptional clarity and precision. Elevate your projects with the unmatched value, benefits, and advantages that the KAI-0340-FBA-CB-AA-DUAL offers, setting you apart from the competition and delivering results that exceed expectations.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications requiring detailed image capture.

Maximum Supply Voltage: 15.25 V

Higher maximum supply voltage provides flexibility in the power supply options for the sensor, allowing it to be used in a wider range of systems.

Body Width: 12.7 inch

Compact body width allows for easy integration into systems with limited space, making this sensor suitable for small form factor devices.

Sensors or Transducers Type: IMAGE SENSOR, CCD

The sensor type CCD (Charge-Coupled Device) is known for its high-quality image output, making this sensor a good choice for applications requiring high image fidelity.

Body Height: 5.15 mm

Low body height allows for sleek design integration and minimizes space requirement, making this sensor suitable for slim devices.

Package Shape or Style: RECTANGULAR

Rectangular package shape is standard and easy to work with, allowing for straightforward integration into various systems.

Minimum Supply Voltage: 14.75 V

Relatively low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources, making this sensor energy-efficient.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range allows for reliable performance in various environmental conditions, making this sensor suitable for outdoor applications.

Horizontal Pixel: 640

Higher horizontal pixel count allows for wider image capture, making this sensor suitable for applications requiring a broader field of view.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature range ensures the sensor can operate in extreme cold conditions, making it suitable for industrial and outdoor use.

Housing: CERAMIC

Ceramic housing provides durability and thermal stability, ensuring the sensor's performance is not affected by temperature fluctuations, making it reliable for long-term use.

Dynamic Range: 69 dB

High dynamic range allows the sensor to capture a wide range of light intensities, ensuring accurate and detailed image reproduction, making this sensor suitable for applications with varying lighting conditions.

Vertical Pixel: 480

Vertical pixel count contributes to the sensor's resolution capability, ensuring detailed image capture in the vertical axis, making this sensor suitable for applications requiring precise image rendering.

Body Length/Diameter: 15.87 mm

Compact body length/diameter allows for easy integration and positioning in systems, making this sensor suitable for applications with space constraints.

Optical Format (inch): 1/3

Standard optical format 1/3 ensures compatibility with a wide range of lenses and optical systems, making this sensor versatile for different imaging setups.

Termination Type: SOLDER

Solder termination type allows for secure and reliable connections, ensuring the sensor's electrical connections remain stable in various operating conditions.

Array Type: INTERLINE

Interline array type allows for fast image readout and reduced image lag, making this sensor suitable for applications requiring real-time imaging.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature provides secure and stable installation, ensuring the sensor remains firmly attached to the system board, making it suitable for rugged applications.

Technical Specifications

Image Sensors KAI-0340-FBA-CB-AA-DUAL attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; IT ALSO HAVE DYNAMIC RANGE 62 DB

Array Type:

INTERLINE

Body Width:

12.7 inch

Body Height:

5.15 mm

Body Length/Diameter:

15.87 mm

Dynamic Range:

69 dB

Horizontal Pixel:

640

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/3

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.25 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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