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HGT1S7N60A4S9A

Onsemi

HGT1S7N60A4S9A by Onsemi

HGT1S7N60A4S9A by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 2.7V and a max collector-emitter voltage of 600V. It is designed for power control applications, featuring a max power dissipation of 125W and operating temperature range from -55 to 150 °C.

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1k+

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Vyrian

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Digiode

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Northwest PG Solutions

USA . 1,564 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,738 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,492 parts In-Stock

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SupplyDigital Components

Austria . 3,871 parts In-Stock

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Supply Digital

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Kulean Microsystems

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Problanco Electronics

Mexico . 2,778 parts In-Stock

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TANS Electronics

Latvia . 1,320 parts In-Stock

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Corphita

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Native Components

USA . 526 parts In-Stock

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UHIMA Technologies

Türkiye . 242 parts In-Stock

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Corohmni

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Overview

Experience the power of innovation with the HGT1S7N60A4S9A by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for power control applications. With a maximum VCEsat of 2.7V and a maximum collector-emitter voltage of 600V, this N-channel transistor offers unparalleled performance and reliability. Enjoy the benefits of faster turn-off times, lower power dissipation, and higher efficiency for your projects. Take your designs to the next level with the HGT1S7N60A4S9A and see the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and reliable housing for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and faster switching speeds compared to P-channel, making them efficient for power control.

Configuration: SINGLE

Simplified design for easy integration into circuits and systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in managing power output.

Surface Mount: YES

Easy assembly onto circuit boards, saving time and effort in production.

Maximum VCEsat: 2.7 V

Low VCEsat reduces power dissipation and improves efficiency in power control applications.

Package Shape: RECTANGULAR

Space-efficient design for compact circuit layouts.

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs, ensuring secure connections.

Maximum Fall Time (tf): 85 ns

Fast fall time enables quick switching transitions, crucial for power control tasks.

Nominal Turn Off Time (toff): 205 ns

Optimal turn-off time for efficient power management and control.

No. of Terminals: 2

Simplified connectivity with only two terminals, making installation straightforward.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capability ensures reliable performance under demanding operating conditions.

Package Style (Meter): SMALL OUTLINE

Space-saving package style ideal for compact electronic devices and systems.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows for versatile use in different environments.

Maximum Collector-Emitter Voltage: 600 V

High VCE voltage rating enables handling of high power levels effectively.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

Safe gate-emitter voltage rating to protect the transistor during operation.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures operation in harsh environmental conditions.

Maximum Collector Current (IC): 34 A

High collector current rating for handling larger power loads efficiently.

Maximum Gate-Emitter Threshold Voltage: 7 V

Optimal threshold voltage for reliable gate control and switching performance.

Maximum Turn Off Time (toff): 235 ns

Sufficient turn-off time for effective power control and management.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection in circuits.

Case Connection: COLLECTOR

Collector case connection for efficient power handling and management.

Nominal Turn On Time (ton): 17 ns

Fast turn-on time ensures quick response and operation in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGT1S7N60A4S9A attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

85 ns

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

235 ns

Nominal Turn Off Time (toff):

205 ns

Nominal Turn On Time (ton):

17 ns

Maximum VCEsat:

2.7 V

Trade Compliance

HGT1S7N60A4S9A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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