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FF600R12IE4VBOSA1

Infineon Technologies

FF600R12IE4VBOSA1 by Infineon Technologies

FF600R12IE4VBOSA1 by Infineon is an N-CHANNEL IGBT with 2 elements, built-in diode, and thermistor. It has a max voltage of 1200V, turn-off time of 1020ns, and turn-on time of 410ns. Ideal for applications requiring high power switching in industrial settings due to its isolated case connection and flange mount package style.

Median Price

$488.887

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 57 parts In-Stock

1+ parts

$391.110

100+ parts

$367.640

1k+ parts

$344.180

10k+ parts

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57

$391.110

$367.640

$344.180

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Verical

USA . 57 parts In-Stock

1+ parts

$488.887

100+ parts

$459.550

1k+ parts

$430.225

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57

$488.887

$459.550

$430.225

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DigiKey

USA . 57 parts In-Stock

1+ parts

$488.890

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57

$488.890

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Flip Electronics (Authorized)

USA . 3 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$425.021

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300

$425.021

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Digiode

USA . 474 parts In-Stock

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$432.506

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474

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Vyrian

USA . 2,520 parts In-Stock

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Flip Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 13,572 parts In-Stock

1+ parts

$1.499

100+ parts

$1.439

1k+ parts

$1.379

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13,572

$1.499

$1.439

$1.379

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AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$14.457

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226

$14.457

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Ampacity Inc.

Singapore . 44 parts In-Stock

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$386.980

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Corphita

USA . 7 parts In-Stock

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$409.743

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7

$409.743

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Netroflash

USA . 1,000 parts In-Stock

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$425.021

100+ parts

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$403.770

10k+ parts

$395.270

1,000

$425.021

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$403.770

$395.270

Component Stockers USA

USA . 42 parts In-Stock

1+ parts

$465.210

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42

$465.210

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Microchip USA

USA . 7,477 parts In-Stock

1+ parts

$655.560

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7,477

$655.560

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QUARKTWIN TECHNOLOGY LTD

USA . 28,793 parts In-Stock

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28,793

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Perfect Parts

USA . 10 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the FF600R12IE4VBOSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT) products. This N-CHANNEL transistor boasts a series connected configuration with built-in diode and thermistor, making it ideal for a wide range of applications. From industrial machinery to renewable energy systems, this versatile component offers unparalleled performance and efficiency. Stay ahead of the curve with the FF600R12IE4VBOSA1 and experience the benefits of superior design and engineering excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and faster switching speeds compared to P-channel IGBTs, making them suitable for many high-power applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for efficient power distribution and monitoring, enhancing overall performance and safety.

Maximum Collector-Emitter Voltage: 1200 V

Capable of handling high voltage levels, making it suitable for high-power applications where voltage spikes may occur.

Nominal Turn Off Time (toff): 1020 ns

Fast turn-off time helps in reducing power dissipation and improving efficiency in high-frequency applications.

Nominal Turn On Time (ton): 410 ns

Fast turn-on time ensures quick switching, improving overall performance and response time.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF600R12IE4VBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-PUFM-X10

No. of Elements:

2

No. of Terminals:

10

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

GENERAL PURPOSE

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1020 ns

Nominal Turn On Time (ton):

410 ns

Trade Compliance

FF600R12IE4VBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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