Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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FIDO5100BBCZ
Analog Devices
FIDO5100BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With CMOS technology and a supply voltage of 1.2V, it's ideal for telecom circuit integration in compact spaces.
S-PBGA-B144
10 mm
1
144
85 Cel
-40 Cel
PLASTIC/EPOXY
LFBGA
BGA144,12X12,32
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
NOT SPECIFIED
1.24 mm
1.2 V
YES
CMOS
TELECOM CIRCUIT
INDUSTRIAL
BALL
.8 mm
BOTTOM
FIDO5200BBCZ
FIDO5200BBCZ by Analog Devices is a telecom IC with 144 terminals in a low-profile grid array package. It operates b/w -40°C to 85°C, suitable for industrial applications. With CMOS technology and a nominal voltage of 1.2V, it's ideal for telecom circuit integration.
CC2564BYFVR-XI
Texas Instruments
CC2564BYFVR-XI by Texas Instruments is a 54-terminal IC with a package style of GRID ARRAY. It operates at -40 to 85°C, has a data rate of 4 Mbps, and requires a nominal voltage of 3.6 V. Ideal for telecom circuits, this IC is surface mountable and features TIN SILVER COPPER terminal finish.
4 Mbps
R-XBGA-B54
e1
3.26 mm
54
UNSPECIFIED
VFBGA
RECTANGULAR
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
260
.575 mm
3.6 V
TIN SILVER COPPER
.4 mm
30
2.93 mm
CC2560BYFVR
CC2560BYFVR by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.
R-PBGA-B54
3.265 mm
2.925 mm
CC2560BYFVT
CC2560BYFVT by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.
STA8090EXGAJTR
STMicroelectronics
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B169
9 mm
169
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
AEC-Q100
1.2 mm
1.1 V
.65 mm
STA8090EXGAJ
STA8090EXGATR
STA8090EXGA
e3
3
MATTE TIN
NL3HS644FCTAG
Onsemi
NL3HS644FCTAG by Onsemi is a 36-terminal, telecom interface IC with a nominal voltage of 3.3V. It features a grid array package style with very thin profile and fine pitch, suitable for telecom circuit applications. The package body material is plastic/epoxy, making it surface mountable with a terminal pitch of 0.4mm and max seated height of 0.54mm.
S-PBGA-B36
2.34 mm
36
.54 mm
3.3 V
LMS7002M
Lime Microsystems
Lime Microsystems' LMS7002M is a telecom IC with 261 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.2V and uses a grid array package style. Ideal for industrial applications requiring precise telecom circuit functionality in compact form factor.
S-PBGA-B261
11.5 mm
261
BGA
GRID ARRAY
IP4047CX6/LF,135
Nexperia
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;
R-PBGA-B6
1.44 mm
6
.7 mm
.5 mm
.99 mm
ADRV9009BBCZ
Analog Devices ADRV9009BBCZ is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a fine pitch terminal style and tin silver copper finish.
S-PBGA-B196
12 mm
196
1.27 mm
1.3 V
ADRV9008BBCZ-1
ADRV9008BBCZ-1 by Analog Devices is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom applications requiring precise signal processing and connectivity in industrial environments.
ADRV9008BBCZ-2
Analog Devices' ADRV9008BBCZ-2 is a telecom IC with 196 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features a bottom terminal position and plastic/epoxy body material.
STHVDAC-253C7
STHVDAC-253C7 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C and 85 °C, with a nominal voltage of 3.3V and features a very thin profile grid array package. Ideal for compact telecom systems, it ensures efficient performance in limited spaces.
R-XBGA-B12
1.45 mm
12
-30 Cel
BGA12,3X4,14
.64 mm
.35 mm
1.1 mm
VSC8490YJU-17
Microchip Technology
VSC8490YJU-17 by Microchip Technology is a telecom IC with 196 terminals in a low-profile grid array package. It operates b/w -40 to 110°C, supporting data rates up to 10 Gbps. Ideal for industrial applications requiring high-speed telecom circuitry in compact form factors.
10000 Mbps
15 mm
110 Cel
LBGA
BGA196,14X14,40
GRID ARRAY, LOW PROFILE
1.4 mm
1 V
1 mm
VSC8491YJU-17
Microchip Technology's VSC8491YJU-17 is a telecom IC with data rate of 10 Gbps. It operates in industrial temperature range (-40 to 110°C) and has 196 terminals in a low profile grid array package. Ideal for telecom applications requiring high-speed data transmission.
PN5120A0ET/C2,151
NXP Semiconductors
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B64
5.5 mm
64
1.15 mm
3 V
OTHER
AFE7700IABJ
AFE7700IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for industrial telecom circuits, it features fine pitch (0.8mm) ball terminals and moisture sensitivity level of MSL3.
RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000
S-PBGA-B400
17 mm
400
FBGA
GRID ARRAY, FINE PITCH
2.65 mm
ADRV9026BBCZ-REEL
Analog Devices' ADRV9026BBCZ-REEL is a telecom IC with 4 functions, operating b/w -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and peak reflow temperature of 260°C.
ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE
S-PBGA-B289
14 mm
4
289
BGA289,17X17,32
1.46 mm
ADRV9026BBCZ
Analog Devices ADRV9026BBCZ is a telecom IC with 4 functions, operating at -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and terminal pitch of 0.8mm.
PM5440B-FEI
PM5440B-FEI by Microchip Technology is a grid array package with 1894 terminals. It is a telecom circuit IC designed for telecom interface applications. The package body material is plastic/epoxy, and it features surface mount technology with bottom terminal position in a square shape.
S-PBGA-B1894
1894
PM5980B-FEI
PM5980B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals. It is a TELECOM CIRCUIT IC for telecom applications, featuring PLASTIC/EPOXY material and BOTTOM terminal position. Suitable for surface mount assembly, it offers high functionality in a compact SQUARE package shape.
S-PBGA-B1932
1932
PM5981B-FEI
PM5981B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals in PLASTIC/EPOXY material. It is a TELECOM CIRCUIT IC designed for telecom interfaces, featuring surface mount capability and ball-shaped bottom terminals.
PM5990B-FEI
PM5990B-FEI by Microchip Technology is a GRID ARRAY IC with 1932 terminals in PLASTIC/EPOXY package. It's a TELECOM CIRCUIT for telecom applications, designed for surface mount with BALL terminals at the bottom.
PM5991B-FEI
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
VSC8491YJU-13
VSC8491YJU-13 by Microchip is a telecom IC with 196 terminals in a low profile grid array package. Operating from -40 to 110°C, it has a nominal voltage of 1V. Ideal for telecom applications, this IC features bottom terminal position and ball-shaped terminals.
WP3160W6NFEI-320B1
WP3160W6NFEI-320B1 by Microchip Technology is a GRID ARRAY IC with 672 terminals in PLASTIC/EPOXY package. It's a TELECOM CIRCUIT for telecom applications, designed for surface mount with BALL terminals at the bottom.
S-PBGA-B672
672
WP3161F5NFEI-320B1
WP3161F5NFEI-320B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its square package shape.
WP3161W6NFEI-320B1
WP3161W6NFEI-320B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its advanced interface functionalities.
WP3161D4NFEI-400B1
WP3161D4NFEI-400B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its advanced interface functionalities.
AD9988BBPZRL-4D4AC
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
S-PBGA-B324
324
120 Cel
GRID ARRAY, HEAT SINK/SLUG
1.72 mm
ADRV9002BBCZ-RL
ADRV9002BBCZ-RL by Analog Devices is a telecom IC with 1 function. It has a package style of grid array, thin profile, and fine pitch. With an operating temperature range of -40 to 110 °C, it is suitable for industrial applications.
BGA196,14X14,32
1.19 mm
ADRV9002BBCZ
Analog Devices ADRV9002BBCZ is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 110°C, with a nominal voltage of 1V. Ideal for telecom circuits, it has a thin profile and fine pitch design for surface mounting applications.
AFE8092IABJ
AFE8092IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, has a data rate of 32500 Mbps, and uses tin silver copper terminal finish. Ideal for industrial telecom circuits requiring high-speed data transmission.
RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500
32500 Mbps
BGA400,20X20,32
D52MD2M8IA-TRAY
Garmin Canada
D52MD2M8IA-TRAY by Garmin Canada is a rectangular MICROELECTRONIC ASSEMBLY with 35 terminals, suitable for telecom applications. It operates in an industrial temperature range from -40 to 85°C and has a terminal pitch of 1.5mm, supporting data rates up to 0.06 Mbps.
.06 Mbps
R-XXMA-B35
35
XMA
MICROELECTRONIC ASSEMBLY
2.11 mm
1.5 mm
9.8 mm
ADRV9004BBCZ-RL
Analog Devices ADRV9004BBCZ-RL is a telecom IC with 2 functions, operating b/w -40 to 85°C. It has 196 terminals in a square grid array package style, suitable for telecom circuit applications. With a nominal voltage of 1V and terminal pitch of 0.8mm, it offers high performance in a compact form factor.
2
1.25 mm
ADRV9004BBCZ
Analog Devices ADRV9004BBCZ is a telecom IC with 2 functions, operating b/w -40 to 85°C. It features a grid array package with 196 terminals and 0.8mm pitch, suitable for telecom interface applications. The PLASTIC/EPOXY body material and bottom terminal position make it ideal for surface mount assembly.
AFE7903IABJ
AFE7903IABJ by Texas Instruments is a telecom IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, has a data rate of 29500 Mbps, and requires a nominal voltage of 0.925 V. Ideal for telecom applications requiring high-speed data transmission.
ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz
29500 Mbps
.925 V
BC57G687C-ANN-E4
Qualcomm
BC57G687C-ANN-E4 by Qualcomm is a telecom interface IC with 105 terminals in a low profile grid array package. Operating temperature ranges from -40 to 85°C, supporting data rates up to 12 Mbps. Ideal for telecom circuits, it has a nominal voltage of 1.5V and terminal pitch of 0.8mm.
12 Mbps
S-PBGA-B105
105
BGA105,11X11,32
1.6 mm
1.5 V
AFE7903IALK
AFE7903IALK by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with a data rate of 29500 Mbps. Ideal for telecom circuits, it has a nominal voltage of 0.925V and terminal pitch of 0.8mm.
e0
220
TIN LEAD
AFE8092HIABJ
AFE8092HIABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, has a data rate of 32500 Mbps, and features tin silver copper terminal finish. Ideal for high-speed telecom applications due to its fine pitch design and moisture sensitivity level of 3.
RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500
AFE7952IABJ
AFE7952IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It offers a data rate of 29500 Mbps and operates at a peak reflow temperature of 260°C. Ideal for high-speed telecommunications applications due to its fine pitch design and tin silver copper terminal finish.
RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000
AFE8000IABJ
AFE8000IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, has a data rate of 32500 Mbps, and features tin silver copper terminal finish. This IC is suitable for high-speed telecommunications applications.
RF frequency(Max)(MHz) : 7000
AFE7901IALK
AFE7901IALK by Texas Instruments is a telecom IC with 400 terminals in a grid array package. It operates b/w -40 to 85°C, with a data rate of 29500 Mbps. Ideal for telecom circuits, it has a terminal pitch of 0.8mm and uses tin-lead terminal finish.
AFE7901IABJ
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 400; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
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