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AFE8000IABJ

Texas Instruments

AFE8000IABJ by Texas Instruments

AFE8000IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, has a data rate of 32500 Mbps, and features tin silver copper terminal finish. This IC is suitable for high-speed telecommunications applications.

Median Price

$3,361.045

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,670 parts In-Stock

1+ parts

$2,475.600

100+ parts

$2,269.300

1k+ parts

$2,063.000

10k+ parts

-

2,670

$2,475.600

$2,269.300

$2,063.000

-

Mouser Electronics

USA . 81 parts In-Stock

1+ parts

$4,246.490

100+ parts

-

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10k+ parts

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81

$4,246.490

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,158 parts In-Stock

1+ parts

$2,351.820

100+ parts

-

1k+ parts

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10k+ parts

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3,158

$2,351.820

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Vyrian

USA . 5,518 parts In-Stock

1+ parts

-

100+ parts

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5,518

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,317 parts In-Stock

1+ parts

$2,104.260

100+ parts

$2,051.654

1k+ parts

$2,041.132

10k+ parts

-

1,317

$2,104.260

$2,051.654

$2,041.132

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Ampacity Inc.

Singapore . 1,080 parts In-Stock

1+ parts

$2,104.260

100+ parts

-

1k+ parts

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1,080

$2,104.260

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Corphita

USA . 3,174 parts In-Stock

1+ parts

$2,228.040

100+ parts

-

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3,174

$2,228.040

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Corohmni

South Africa . 485 parts In-Stock

1+ parts

$2,475.600

100+ parts

-

1k+ parts

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485

$2,475.600

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Northwest PG Solutions

USA . 1,890 parts In-Stock

1+ parts

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1,890

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Native Components

USA . 43 parts In-Stock

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43

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Overview

Experience unparalleled performance and reliability with the AFE8000IABJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in their products. This telecom interface IC is perfect for a wide range of applications, offering seamless connectivity and efficient data transmission. Elevate your projects with this cutting-edge technology that provides unmatched value, benefits, and advantages to customers. Trust Texas Instruments to deliver excellence in every aspect of your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, which is ideal for telecom applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of the product onto circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it suitable for applications where size constraints are a concern.

No. of Terminals: 400

Having 400 terminals allows for a high level of connectivity and functionality, making the product versatile and capable of handling complex telecom interfaces.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

The product's ability to operate in temperatures as low as -40°C makes it suitable for use in a wide range of environments, including extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom enables easy and secure attachment to circuit boards, enhancing the overall reliability and stability of the product.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm allows for a sleek and compact design, making the product suitable for applications where space is limited.

Width: 17 mm

The 17 mm width provides a balance between compactness and ease of handling, making the product versatile and easy to integrate into different systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and thermal management during the manufacturing process, contributing to product reliability.

Length: 17 mm

The 17 mm length complements the square package shape, offering a compact form factor that is well-suited for telecom applications with space constraints.

Terminal Form: BALL

The use of ball terminal form facilitates easy soldering and secure connections, ensuring efficient assembly and reliable performance of the product.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this product is optimized for telecom applications, offering advanced features and performance tailored to the industry's requirements.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm allows for high-density packaging and precise connectivity, enabling the product to handle complex telecom interfaces efficiently.

Data Rate: 32500 Mbps

With a high data rate of 32500 Mbps, the product is capable of handling large volumes of data quickly and efficiently, making it suitable for high-speed telecom applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product has a moderate level of sensitivity to moisture, making it suitable for use in a variety of environments while requiring standard handling precautions.

Technical Specifications

Other Function Telecom Interface ICs AFE8000IABJ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Additional Features:

RF frequency(Max)(MHz) : 7000

Data Rate:

32500 Mbps

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

AFE8000IABJ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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